JPWO2022172898A1 - - Google Patents
Info
- Publication number
- JPWO2022172898A1 JPWO2022172898A1 JP2022580622A JP2022580622A JPWO2022172898A1 JP WO2022172898 A1 JPWO2022172898 A1 JP WO2022172898A1 JP 2022580622 A JP2022580622 A JP 2022580622A JP 2022580622 A JP2022580622 A JP 2022580622A JP WO2022172898 A1 JPWO2022172898 A1 JP WO2022172898A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021019614 | 2021-02-10 | ||
| PCT/JP2022/004729 WO2022172898A1 (en) | 2021-02-10 | 2022-02-07 | Substrate bonding method, substrate bonding system, and microfluidic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022172898A1 true JPWO2022172898A1 (en) | 2022-08-18 |
Family
ID=82837871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022580622A Pending JPWO2022172898A1 (en) | 2021-02-10 | 2022-02-07 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2022172898A1 (en) |
| WO (1) | WO2022172898A1 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003211545A (en) * | 2002-01-29 | 2003-07-29 | Mitsui Chemicals Inc | Manufacturing method for flexible double-sided metal laminate |
| JP5598432B2 (en) * | 2011-06-29 | 2014-10-01 | 住友ベークライト株式会社 | Microchannel device manufacturing method and microchannel chip |
| JP7109068B2 (en) * | 2018-07-13 | 2022-07-29 | サムコ株式会社 | Method for bonding cycloolefin polymer |
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2022
- 2022-02-07 WO PCT/JP2022/004729 patent/WO2022172898A1/en active Application Filing
- 2022-02-07 JP JP2022580622A patent/JPWO2022172898A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022172898A1 (en) | 2022-08-18 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230519 |