JPWO2022162806A1 - - Google Patents
Info
- Publication number
- JPWO2022162806A1 JPWO2022162806A1 JP2021568177A JP2021568177A JPWO2022162806A1 JP WO2022162806 A1 JPWO2022162806 A1 JP WO2022162806A1 JP 2021568177 A JP2021568177 A JP 2021568177A JP 2021568177 A JP2021568177 A JP 2021568177A JP WO2022162806 A1 JPWO2022162806 A1 JP WO2022162806A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/84—Safety devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N20/00—Machine learning
Landscapes
- Engineering & Computer Science (AREA)
- Software Systems (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Theoretical Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Evolutionary Computation (AREA)
- Medical Informatics (AREA)
- Data Mining & Analysis (AREA)
- Physics & Mathematics (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Artificial Intelligence (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/002919 WO2022162806A1 (en) | 2021-01-27 | 2021-01-27 | Abnormality monitoring device, abnormality monitoring method, and abnormality monitoring program |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022162806A1 true JPWO2022162806A1 (en) | 2022-08-04 |
Family
ID=82652696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021568177A Pending JPWO2022162806A1 (en) | 2021-01-27 | 2021-01-27 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2022162806A1 (en) |
WO (1) | WO2022162806A1 (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0422836B2 (en) * | 1984-08-13 | 1992-04-20 | Gusuto Eng Bv | |
JPH08132503A (en) * | 1994-11-11 | 1996-05-28 | Etou Denki Kk | Mold monitoring device |
JPH1148301A (en) * | 1997-08-07 | 1999-02-23 | Toyo Kogaku Kk | Multiple supervisory device for mold |
JP2009012214A (en) * | 2007-07-02 | 2009-01-22 | Ushio Inc | Mold monitor |
JP2012143894A (en) * | 2011-01-07 | 2012-08-02 | Sigumakkusu Kk | Injection molding machine monitoring device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6722836B1 (en) * | 2019-11-29 | 2020-07-15 | 菱洋エレクトロ株式会社 | Abnormality monitoring device, abnormality monitoring method, and abnormality monitoring program |
-
2021
- 2021-01-27 WO PCT/JP2021/002919 patent/WO2022162806A1/en active Application Filing
- 2021-01-27 JP JP2021568177A patent/JPWO2022162806A1/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0422836B2 (en) * | 1984-08-13 | 1992-04-20 | Gusuto Eng Bv | |
JPH08132503A (en) * | 1994-11-11 | 1996-05-28 | Etou Denki Kk | Mold monitoring device |
JPH1148301A (en) * | 1997-08-07 | 1999-02-23 | Toyo Kogaku Kk | Multiple supervisory device for mold |
JP2009012214A (en) * | 2007-07-02 | 2009-01-22 | Ushio Inc | Mold monitor |
JP2012143894A (en) * | 2011-01-07 | 2012-08-02 | Sigumakkusu Kk | Injection molding machine monitoring device |
Also Published As
Publication number | Publication date |
---|---|
WO2022162806A1 (en) | 2022-08-04 |
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