JPWO2022130892A1 - - Google Patents
Info
- Publication number
- JPWO2022130892A1 JPWO2022130892A1 JP2022569801A JP2022569801A JPWO2022130892A1 JP WO2022130892 A1 JPWO2022130892 A1 JP WO2022130892A1 JP 2022569801 A JP2022569801 A JP 2022569801A JP 2022569801 A JP2022569801 A JP 2022569801A JP WO2022130892 A1 JPWO2022130892 A1 JP WO2022130892A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020207192 | 2020-12-15 | ||
PCT/JP2021/042517 WO2022130892A1 (en) | 2020-12-15 | 2021-11-19 | Conductive ink for copper-nickel alloy electrodes, copper-nickel alloy electrode-bearing substrate, and their methods of production |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022130892A1 true JPWO2022130892A1 (en) | 2022-06-23 |
Family
ID=82058734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022569801A Pending JPWO2022130892A1 (en) | 2020-12-15 | 2021-11-19 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2022130892A1 (en) |
KR (1) | KR20230019148A (en) |
CN (1) | CN116323044A (en) |
WO (1) | WO2022130892A1 (en) |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2002337822A1 (en) * | 2001-10-05 | 2003-04-22 | Superior Micropowders Llc | Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
KR100727434B1 (en) * | 2005-03-04 | 2007-06-13 | 주식회사 잉크테크 | Transparent silver inks and their methods for forming thin layers |
KR100658492B1 (en) * | 2005-03-21 | 2006-12-15 | 주식회사 잉크테크 | Conductive inks and their methods for forming thin layers |
JP4924812B2 (en) * | 2006-12-19 | 2012-04-25 | 住友金属鉱山株式会社 | Nickel film forming coating solution, nickel film and method for producing the same |
JP2010064983A (en) | 2008-09-11 | 2010-03-25 | Nippon Steel Chem Co Ltd | Method for producing nickel particle and nickel complex suitably used therein |
JP5486886B2 (en) | 2009-09-15 | 2014-05-07 | Dowaエレクトロニクス株式会社 | Copper-nickel nanoparticles and method for producing the same |
JP2011214144A (en) * | 2010-03-17 | 2011-10-27 | Nippon Steel Chem Co Ltd | Method for production of nickel nanoparticle |
JP2012131894A (en) * | 2010-12-21 | 2012-07-12 | Tosoh Corp | Electrically conductive ink composition and electric conduction part produced using the same |
JP2013125655A (en) * | 2011-12-14 | 2013-06-24 | Hitachi Chemical Co Ltd | Conductive adhesive material, conductive laminate, method for manufacturing conductive laminate, wiring board, display device, and solar cell module |
JP2014139893A (en) * | 2013-01-21 | 2014-07-31 | Fujifilm Corp | Method of producing conductive layer containing laminate |
JP6037893B2 (en) * | 2013-02-26 | 2016-12-07 | 新日鉄住金化学株式会社 | Metal fine particle composition, bonding material, electronic component, method for forming bonding layer, method for forming conductor layer, and ink composition |
JP5922810B1 (en) * | 2015-02-03 | 2016-05-24 | 古河電気工業株式会社 | Fine particles, fine particle dispersion solution, and method for producing fine particles |
JP6531456B2 (en) * | 2015-03-26 | 2019-06-19 | 東ソー株式会社 | Conductive ink composition |
JP6627551B2 (en) * | 2015-11-30 | 2020-01-08 | 住友金属鉱山株式会社 | Laminated substrate, conductive substrate, method for producing laminated substrate, method for producing conductive substrate |
KR101855121B1 (en) * | 2016-05-02 | 2018-06-11 | 서울대학교산학협력단 | Electroconductive ink composite including metal-organic precursor and polyhydric alcohol capable of heating in the air and method for forming the metal line using the same |
-
2021
- 2021-11-19 WO PCT/JP2021/042517 patent/WO2022130892A1/en active Application Filing
- 2021-11-19 CN CN202180068292.0A patent/CN116323044A/en active Pending
- 2021-11-19 JP JP2022569801A patent/JPWO2022130892A1/ja active Pending
- 2021-11-19 KR KR1020227046040A patent/KR20230019148A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN116323044A (en) | 2023-06-23 |
WO2022130892A1 (en) | 2022-06-23 |
KR20230019148A (en) | 2023-02-07 |
Similar Documents
Legal Events
Date | Code | Title | Description |
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A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20221213 |
|
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Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240116 |
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