JPWO2022124180A1 - - Google Patents

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Publication number
JPWO2022124180A1
JPWO2022124180A1 JP2022568229A JP2022568229A JPWO2022124180A1 JP WO2022124180 A1 JPWO2022124180 A1 JP WO2022124180A1 JP 2022568229 A JP2022568229 A JP 2022568229A JP 2022568229 A JP2022568229 A JP 2022568229A JP WO2022124180 A1 JPWO2022124180 A1 JP WO2022124180A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022568229A
Other languages
Japanese (ja)
Other versions
JP7373080B2 (en
JPWO2022124180A5 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022124180A1 publication Critical patent/JPWO2022124180A1/ja
Publication of JPWO2022124180A5 publication Critical patent/JPWO2022124180A5/ja
Application granted granted Critical
Publication of JP7373080B2 publication Critical patent/JP7373080B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
JP2022568229A 2020-12-07 2021-12-02 Conductive liquid crystal resin composition Active JP7373080B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020202782 2020-12-07
JP2020202782 2020-12-07
PCT/JP2021/044205 WO2022124180A1 (en) 2020-12-07 2021-12-02 Conductive liquid-crystalline resin composition

Publications (3)

Publication Number Publication Date
JPWO2022124180A1 true JPWO2022124180A1 (en) 2022-06-16
JPWO2022124180A5 JPWO2022124180A5 (en) 2023-02-03
JP7373080B2 JP7373080B2 (en) 2023-11-01

Family

ID=81973181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022568229A Active JP7373080B2 (en) 2020-12-07 2021-12-02 Conductive liquid crystal resin composition

Country Status (5)

Country Link
JP (1) JP7373080B2 (en)
KR (1) KR20230116010A (en)
CN (1) CN116601230A (en)
TW (1) TW202231763A (en)
WO (1) WO2022124180A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04311758A (en) * 1991-04-10 1992-11-04 Toray Ind Inc Liquid crystal polymer resin composition
JP2002194194A (en) * 2000-12-25 2002-07-10 Polyplastics Co Semiconductive resin composition and molded product
JP2018048306A (en) * 2016-09-14 2018-03-29 住友化学株式会社 Liquid-crystalline resin composition

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0739533B2 (en) * 1986-12-10 1995-05-01 ポリプラスチックス株式会社 Liquid crystalline polyester resin composition
JP4161494B2 (en) * 1998-12-11 2008-10-08 東レ株式会社 Flame retardant resin composition, its long fiber pellets and its molded product
JP4724900B2 (en) * 1999-07-13 2011-07-13 東レ株式会社 Flame retardant polyamide resin composition and molded article thereof
JP2001067933A (en) * 1999-08-24 2001-03-16 Toray Ind Inc Conductive resin composition and mold thereof
US20040113129A1 (en) 2002-07-25 2004-06-17 Waggoner Marion G. Static dissipative thermoplastic polymer composition
JP4302508B2 (en) 2003-12-26 2009-07-29 ポリプラスチックス株式会社 Conductive resin composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04311758A (en) * 1991-04-10 1992-11-04 Toray Ind Inc Liquid crystal polymer resin composition
JP2002194194A (en) * 2000-12-25 2002-07-10 Polyplastics Co Semiconductive resin composition and molded product
JP2018048306A (en) * 2016-09-14 2018-03-29 住友化学株式会社 Liquid-crystalline resin composition

Also Published As

Publication number Publication date
KR20230116010A (en) 2023-08-03
JP7373080B2 (en) 2023-11-01
TW202231763A (en) 2022-08-16
CN116601230A (en) 2023-08-15
WO2022124180A1 (en) 2022-06-16

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