JPWO2022102451A1 - - Google Patents
Info
- Publication number
- JPWO2022102451A1 JPWO2022102451A1 JP2022523343A JP2022523343A JPWO2022102451A1 JP WO2022102451 A1 JPWO2022102451 A1 JP WO2022102451A1 JP 2022523343 A JP2022523343 A JP 2022523343A JP 2022523343 A JP2022523343 A JP 2022523343A JP WO2022102451 A1 JPWO2022102451 A1 JP WO2022102451A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020187367 | 2020-11-10 | ||
PCT/JP2021/040230 WO2022102451A1 (en) | 2020-11-10 | 2021-11-01 | Polyimide film and production method therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022102451A1 true JPWO2022102451A1 (en) | 2022-05-19 |
Family
ID=81602217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022523343A Pending JPWO2022102451A1 (en) | 2020-11-10 | 2021-11-01 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022102451A1 (en) |
KR (1) | KR20230098789A (en) |
CN (1) | CN116137837A (en) |
TW (1) | TW202222914A (en) |
WO (1) | WO2022102451A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115058040B (en) * | 2022-06-23 | 2023-10-03 | 华中科技大学 | Double-layer polyimide film and preparation method and application thereof |
CN115141372B (en) * | 2022-08-08 | 2024-01-26 | 波米科技有限公司 | Polyimide substance and application thereof |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3425854B2 (en) | 1997-10-02 | 2003-07-14 | 日本電信電話株式会社 | Low refractive index transparent polyimide copolymer, precursor solution thereof, and production method thereof |
JP2002146021A (en) | 2000-11-10 | 2002-05-22 | Ube Ind Ltd | Soluble and transparent polyimide and method for producing the same |
JP2002348374A (en) | 2001-05-25 | 2002-12-04 | Hitachi Cable Ltd | Polyamic acid or polyimide and liquid crystalline orientating agent |
KR101423361B1 (en) | 2007-05-24 | 2014-07-24 | 미츠비시 가스 가가쿠 가부시키가이샤 | Process and apparatus for production of colorless transparent resin film |
KR102014627B1 (en) * | 2015-02-09 | 2019-08-26 | 코니카 미놀타 가부시키가이샤 | Method for manufacturing transparent heat resistant laminated film, transparent heat resistant laminated film, flexible printed circuit board, flexible display substrate, front panel for flexible display, LED lighting device and organic electroluminescent display device |
KR102109787B1 (en) * | 2016-12-27 | 2020-05-12 | 주식회사 엘지화학 | Plastic laminated film |
JP6973476B2 (en) * | 2017-04-06 | 2021-12-01 | 大日本印刷株式会社 | Polyimide film, laminates, and surface materials for displays |
TW202108664A (en) * | 2019-06-27 | 2021-03-01 | 日商日鐵化學材料股份有限公司 | Resin film, metal-clad laminate and method for producing same |
-
2021
- 2021-11-01 WO PCT/JP2021/040230 patent/WO2022102451A1/en active Application Filing
- 2021-11-01 JP JP2022523343A patent/JPWO2022102451A1/ja active Pending
- 2021-11-01 KR KR1020237011998A patent/KR20230098789A/en unknown
- 2021-11-01 CN CN202180057843.3A patent/CN116137837A/en active Pending
- 2021-11-03 TW TW110140901A patent/TW202222914A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW202222914A (en) | 2022-06-16 |
WO2022102451A1 (en) | 2022-05-19 |
CN116137837A (en) | 2023-05-19 |
KR20230098789A (en) | 2023-07-04 |