JPWO2022102245A1 - - Google Patents
Info
- Publication number
- JPWO2022102245A1 JPWO2022102245A1 JP2021559011A JP2021559011A JPWO2022102245A1 JP WO2022102245 A1 JPWO2022102245 A1 JP WO2022102245A1 JP 2021559011 A JP2021559011 A JP 2021559011A JP 2021559011 A JP2021559011 A JP 2021559011A JP WO2022102245 A1 JPWO2022102245 A1 JP WO2022102245A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020187044 | 2020-11-10 | ||
| JP2021052856 | 2021-03-26 | ||
| JP2021108521 | 2021-06-30 | ||
| PCT/JP2021/034304 WO2022102245A1 (ja) | 2020-11-10 | 2021-09-17 | 導電パターン付き基板の製造方法および転写装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022102245A1 true JPWO2022102245A1 (enrdf_load_stackoverflow) | 2022-05-19 |
Family
ID=81601913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021559011A Pending JPWO2022102245A1 (enrdf_load_stackoverflow) | 2020-11-10 | 2021-09-17 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022102245A1 (enrdf_load_stackoverflow) |
| TW (1) | TW202220512A (enrdf_load_stackoverflow) |
| WO (1) | WO2022102245A1 (enrdf_load_stackoverflow) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59149086A (ja) * | 1983-02-15 | 1984-08-25 | 松下電器産業株式会社 | 曲面印刷装置 |
| JPS61253889A (ja) * | 1985-05-07 | 1986-11-11 | 株式会社日本製鋼所 | 電子部品用基板への転写配線方法及び装置 |
| JPH0521302A (ja) * | 1991-07-15 | 1993-01-29 | Murata Mfg Co Ltd | 基板側面の電極形成方法及びその装置 |
| JP6769313B2 (ja) * | 2017-01-23 | 2020-10-14 | 東レ株式会社 | 導電パターン形成用フィルム |
-
2021
- 2021-09-17 WO PCT/JP2021/034304 patent/WO2022102245A1/ja not_active Ceased
- 2021-09-17 JP JP2021559011A patent/JPWO2022102245A1/ja active Pending
- 2021-10-08 TW TW110137476A patent/TW202220512A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022102245A1 (ja) | 2022-05-19 |
| TW202220512A (zh) | 2022-05-16 |