JPWO2022075227A1 - - Google Patents
Info
- Publication number
- JPWO2022075227A1 JPWO2022075227A1 JP2022555447A JP2022555447A JPWO2022075227A1 JP WO2022075227 A1 JPWO2022075227 A1 JP WO2022075227A1 JP 2022555447 A JP2022555447 A JP 2022555447A JP 2022555447 A JP2022555447 A JP 2022555447A JP WO2022075227 A1 JPWO2022075227 A1 JP WO2022075227A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1807—C7-(meth)acrylate, e.g. heptyl (meth)acrylate or benzyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/062—Copolymers with monomers not covered by C08L33/06
- C08L33/064—Copolymers with monomers not covered by C08L33/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0256—Electrical insulation details, e.g. around high voltage areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020169121 | 2020-10-06 | ||
PCT/JP2021/036483 WO2022075227A1 (ja) | 2020-10-06 | 2021-10-01 | 組成物、硬化体及び金属ベース基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022075227A1 true JPWO2022075227A1 (ja) | 2022-04-14 |
Family
ID=81126879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022555447A Pending JPWO2022075227A1 (ja) | 2020-10-06 | 2021-10-01 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP4219621A4 (ja) |
JP (1) | JPWO2022075227A1 (ja) |
CN (1) | CN116234841A (ja) |
WO (1) | WO2022075227A1 (ja) |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7091273B2 (en) * | 2002-05-07 | 2006-08-15 | Akzo Nobel N.V. | Process for preparing a polymer dispersion |
JP4914284B2 (ja) | 2007-04-25 | 2012-04-11 | 電気化学工業株式会社 | 回路基板用組成物とそれを用いた回路基板 |
JP5315923B2 (ja) * | 2007-11-05 | 2013-10-16 | 日立化成株式会社 | アクリル系エラストマー及びこれを用いた組成物 |
TWI520973B (zh) * | 2010-09-01 | 2016-02-11 | Kaneka Corp | 電氣、電子元件材料用組合物及其硬化物 |
WO2012039324A1 (ja) * | 2010-09-22 | 2012-03-29 | 日立化成工業株式会社 | 熱伝導性樹脂組成物、樹脂シート、樹脂付金属箔、樹脂シート硬化物及び放熱部材 |
KR20140074289A (ko) * | 2011-09-08 | 2014-06-17 | 히타치가세이가부시끼가이샤 | 수지 조성물, 수지 시트, 수지 시트 경화물, 수지 부착 금속박 및 방열 부재 |
CN103906785A (zh) * | 2011-11-02 | 2014-07-02 | 日立化成株式会社 | 环氧树脂组合物、半固化环氧树脂组合物、固化环氧树脂组合物、树脂片、预浸料坯、层叠板、金属基板、配线板、半固化环氧树脂组合物的制造方法以及固化环氧树脂组合物的制造方法 |
JP2016155985A (ja) * | 2015-02-26 | 2016-09-01 | 日立化成株式会社 | エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物、及びそれらを用いた樹脂シート、プリプレグ、積層板、金属基板、配線板、パワー半導体装置 |
JP6222209B2 (ja) * | 2015-12-04 | 2017-11-01 | 日立化成株式会社 | 樹脂組成物、樹脂シート、金属箔付き樹脂シート、樹脂硬化物シート、構造体、および動力用又は光源用半導体デバイス |
FI3954719T3 (fi) * | 2019-04-11 | 2023-09-12 | Denka Company Ltd | Kopolymeeri, dispergointiaine ja hartsikoostumus |
JP7144644B2 (ja) * | 2020-10-05 | 2022-09-29 | デンカ株式会社 | 熱伝導性樹脂組成物及び電子機器 |
-
2021
- 2021-10-01 EP EP21877526.0A patent/EP4219621A4/en active Pending
- 2021-10-01 WO PCT/JP2021/036483 patent/WO2022075227A1/ja unknown
- 2021-10-01 CN CN202180065604.2A patent/CN116234841A/zh active Pending
- 2021-10-01 JP JP2022555447A patent/JPWO2022075227A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP4219621A4 (en) | 2024-03-06 |
CN116234841A (zh) | 2023-06-06 |
WO2022075227A1 (ja) | 2022-04-14 |
EP4219621A1 (en) | 2023-08-02 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230615 |