JPWO2022070624A1 - - Google Patents

Info

Publication number
JPWO2022070624A1
JPWO2022070624A1 JP2022522373A JP2022522373A JPWO2022070624A1 JP WO2022070624 A1 JPWO2022070624 A1 JP WO2022070624A1 JP 2022522373 A JP2022522373 A JP 2022522373A JP 2022522373 A JP2022522373 A JP 2022522373A JP WO2022070624 A1 JPWO2022070624 A1 JP WO2022070624A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022522373A
Other languages
Japanese (ja)
Other versions
JPWO2022070624A5 (en
JP7088443B1 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022070624A1 publication Critical patent/JPWO2022070624A1/ja
Application granted granted Critical
Publication of JP7088443B1 publication Critical patent/JP7088443B1/en
Publication of JPWO2022070624A5 publication Critical patent/JPWO2022070624A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2022522373A 2020-09-29 2021-08-11 Manufacturing method of elastic mounting board and elastic mounting board Active JP7088443B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020163625 2020-09-29
JP2020163625 2020-09-29
PCT/JP2021/029619 WO2022070624A1 (en) 2020-09-29 2021-08-11 Flexible mounting board and method for manufacturing flexible mounting board

Publications (3)

Publication Number Publication Date
JPWO2022070624A1 true JPWO2022070624A1 (en) 2022-04-07
JP7088443B1 JP7088443B1 (en) 2022-06-21
JPWO2022070624A5 JPWO2022070624A5 (en) 2022-09-20

Family

ID=80949932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022522373A Active JP7088443B1 (en) 2020-09-29 2021-08-11 Manufacturing method of elastic mounting board and elastic mounting board

Country Status (3)

Country Link
JP (1) JP7088443B1 (en)
CN (1) CN114846911A (en)
WO (1) WO2022070624A1 (en)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002025339A (en) * 2000-07-03 2002-01-25 Matsushita Electric Ind Co Ltd Mounting structure and manufacturing method of the same
JP3779864B2 (en) * 2000-07-19 2006-05-31 古河電気工業株式会社 Electronic component lead wire, method for manufacturing the same, and electronic component using the lead wire
JP2002124755A (en) * 2000-08-09 2002-04-26 Murata Mfg Co Ltd Method and structure for bonding conductive adhesive and electrode
EP2234466B1 (en) * 2007-12-26 2019-04-10 Fujikura Ltd. Mounting board and method of producing the same
JP5177027B2 (en) * 2009-03-12 2013-04-03 日本電気株式会社 Electrode pad manufacturing method, circuit wiring body including electrode pad and manufacturing method thereof, solder joint structure using the electrode pad, and method thereof
JP5405339B2 (en) * 2010-02-03 2014-02-05 日本メクトロン株式会社 Wiring circuit board and manufacturing method thereof
WO2015125944A1 (en) * 2014-02-21 2015-08-27 学校法人早稲田大学 Self-repairing wiring and stretchable device
WO2016050525A1 (en) * 2014-09-29 2016-04-07 Imec Vzw Smart textile product and method for fabricating the same
JP2018014381A (en) * 2016-07-20 2018-01-25 富士通株式会社 Substrate and electronic apparatus
JP2019012745A (en) * 2017-06-29 2019-01-24 パナソニック株式会社 Mounting method of electronic component and mounting substrate
JP7426587B2 (en) * 2017-09-04 2024-02-02 パナソニックＩｐマネジメント株式会社 Stretchable circuit board and patch device using it
CN112384141A (en) * 2019-03-29 2021-02-19 株式会社村田制作所 Stretchable mounting board

Also Published As

Publication number Publication date
JP7088443B1 (en) 2022-06-21
US20220312588A1 (en) 2022-09-29
CN114846911A (en) 2022-08-02
WO2022070624A1 (en) 2022-04-07

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