JPWO2022065418A1 - - Google Patents
Info
- Publication number
- JPWO2022065418A1 JPWO2022065418A1 JP2021567067A JP2021567067A JPWO2022065418A1 JP WO2022065418 A1 JPWO2022065418 A1 JP WO2022065418A1 JP 2021567067 A JP2021567067 A JP 2021567067A JP 2021567067 A JP2021567067 A JP 2021567067A JP WO2022065418 A1 JPWO2022065418 A1 JP WO2022065418A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/18—Non-metallic particles coated with metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Composite Materials (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020160000 | 2020-09-24 | ||
| PCT/JP2021/035021 WO2022065418A1 (en) | 2020-09-24 | 2021-09-24 | Sintering composition, sintered body, and bonded structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022065418A1 true JPWO2022065418A1 (en) | 2022-03-31 |
Family
ID=80846622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021567067A Pending JPWO2022065418A1 (en) | 2020-09-24 | 2021-09-24 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2022065418A1 (en) |
| WO (1) | WO2022065418A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115319330B (en) * | 2022-08-19 | 2023-11-10 | 重庆平创半导体研究院有限责任公司 | Spherical core-shell structure low-temperature sintering soldering paste and preparation method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6346807B2 (en) * | 2014-07-02 | 2018-06-20 | 積水化学工業株式会社 | Conductive particles, bonding composition, bonded structure, and manufacturing method of bonded structure |
| JP7128115B2 (en) * | 2017-09-20 | 2022-08-30 | 積水化学工業株式会社 | METAL-CONTAINING PARTICLES, CONNECTING MATERIAL, CONNECTED STRUCTURE, CONNECTED STRUCTURE MANUFACTURING METHOD, CONDUCTIVITY TESTING MEMBER, AND CONTINUITY TESTING DEVICE |
| WO2020017050A1 (en) * | 2018-07-20 | 2020-01-23 | 日立化成株式会社 | Composition, bonding material, sintered compact, assembly, and method for producing assembly |
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2021
- 2021-09-24 WO PCT/JP2021/035021 patent/WO2022065418A1/en active Application Filing
- 2021-09-24 JP JP2021567067A patent/JPWO2022065418A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022065418A1 (en) | 2022-03-31 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240603 |