JPWO2022059448A1 - - Google Patents

Info

Publication number
JPWO2022059448A1
JPWO2022059448A1 JP2022550432A JP2022550432A JPWO2022059448A1 JP WO2022059448 A1 JPWO2022059448 A1 JP WO2022059448A1 JP 2022550432 A JP2022550432 A JP 2022550432A JP 2022550432 A JP2022550432 A JP 2022550432A JP WO2022059448 A1 JPWO2022059448 A1 JP WO2022059448A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022550432A
Other languages
Japanese (ja)
Other versions
JPWO2022059448A5 (en
JP7318820B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022059448A1 publication Critical patent/JPWO2022059448A1/ja
Publication of JPWO2022059448A5 publication Critical patent/JPWO2022059448A5/ja
Application granted granted Critical
Publication of JP7318820B2 publication Critical patent/JP7318820B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C08G8/20—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with polyhydric phenols
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
JP2022550432A 2020-09-17 2021-08-26 Method for producing resist pattern, resist pattern, and positive photosensitive resin composition for producing transparent laminated member Active JP7318820B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020156080 2020-09-17
JP2020156080 2020-09-17
PCT/JP2021/031290 WO2022059448A1 (en) 2020-09-17 2021-08-26 Method for producing resist pattern, resist pattern and positive photosensitive resin composition for production of transparent multilayer member

Publications (3)

Publication Number Publication Date
JPWO2022059448A1 true JPWO2022059448A1 (en) 2022-03-24
JPWO2022059448A5 JPWO2022059448A5 (en) 2022-12-15
JP7318820B2 JP7318820B2 (en) 2023-08-01

Family

ID=80776887

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022550432A Active JP7318820B2 (en) 2020-09-17 2021-08-26 Method for producing resist pattern, resist pattern, and positive photosensitive resin composition for producing transparent laminated member

Country Status (3)

Country Link
JP (1) JP7318820B2 (en)
TW (1) TW202216821A (en)
WO (1) WO2022059448A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002169277A (en) * 2000-12-05 2002-06-14 Jsr Corp Radiation sensitive resin composition for formation of insulating film of organic el display device, insulating film formed from the composition and organic el display device
JP2007304592A (en) * 2006-05-08 2007-11-22 Dongjin Semichem Co Ltd Photoresist composition
WO2019239784A1 (en) * 2018-06-13 2019-12-19 Dic株式会社 Phenolic novolac resin, method for manufacturing same, photosensitive composition, resist material, and resist film

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002169277A (en) * 2000-12-05 2002-06-14 Jsr Corp Radiation sensitive resin composition for formation of insulating film of organic el display device, insulating film formed from the composition and organic el display device
JP2007304592A (en) * 2006-05-08 2007-11-22 Dongjin Semichem Co Ltd Photoresist composition
WO2019239784A1 (en) * 2018-06-13 2019-12-19 Dic株式会社 Phenolic novolac resin, method for manufacturing same, photosensitive composition, resist material, and resist film

Also Published As

Publication number Publication date
WO2022059448A1 (en) 2022-03-24
JP7318820B2 (en) 2023-08-01
TW202216821A (en) 2022-05-01

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