JPWO2022038875A1 - - Google Patents
Info
- Publication number
- JPWO2022038875A1 JPWO2022038875A1 JP2022543294A JP2022543294A JPWO2022038875A1 JP WO2022038875 A1 JPWO2022038875 A1 JP WO2022038875A1 JP 2022543294 A JP2022543294 A JP 2022543294A JP 2022543294 A JP2022543294 A JP 2022543294A JP WO2022038875 A1 JPWO2022038875 A1 JP WO2022038875A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020139039 | 2020-08-20 | ||
| PCT/JP2021/022431 WO2022038875A1 (ja) | 2020-08-20 | 2021-06-14 | 高分子フィルム積層体の製造方法、高分子フィルム積層体および高分子フィルム積層体を備えるデバイス |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022038875A1 true JPWO2022038875A1 (pt) | 2022-02-24 |
Family
ID=80322850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022543294A Pending JPWO2022038875A1 (pt) | 2020-08-20 | 2021-06-14 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022038875A1 (pt) |
| TW (1) | TW202218881A (pt) |
| WO (1) | WO2022038875A1 (pt) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008137367A (ja) * | 2006-11-08 | 2008-06-19 | Hitachi Chem Co Ltd | 金属張積層板、並びに印刷回路板及びその製造方法 |
| JP2008201117A (ja) * | 2007-01-24 | 2008-09-04 | Hitachi Chem Co Ltd | 樹脂付き金属薄膜、印刷回路板及びその製造方法、並びに、多層配線板及びその製造方法 |
| JP2009073943A (ja) * | 2007-09-20 | 2009-04-09 | Seiko Epson Corp | 接合方法および接合体 |
| WO2013154107A1 (ja) * | 2012-04-10 | 2013-10-17 | ランテクニカルサービス株式会社 | 高分子フィルムと高分子フィルムとを接合する方法、高分子フィルムと無機材料基板とを接合する方法、高分子フィルム積層体及び高分子フィルムと無機材料基板との積層体 |
-
2021
- 2021-06-14 JP JP2022543294A patent/JPWO2022038875A1/ja active Pending
- 2021-06-14 WO PCT/JP2021/022431 patent/WO2022038875A1/ja active Application Filing
- 2021-08-17 TW TW110130290A patent/TW202218881A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202218881A (zh) | 2022-05-16 |
| WO2022038875A1 (ja) | 2022-02-24 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220907 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230912 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20240305 |