JPWO2022019205A1 - - Google Patents
Info
- Publication number
- JPWO2022019205A1 JPWO2022019205A1 JP2022537962A JP2022537962A JPWO2022019205A1 JP WO2022019205 A1 JPWO2022019205 A1 JP WO2022019205A1 JP 2022537962 A JP2022537962 A JP 2022537962A JP 2022537962 A JP2022537962 A JP 2022537962A JP WO2022019205 A1 JPWO2022019205 A1 JP WO2022019205A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41733—Source or drain electrodes for field effect devices for thin film transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66969—Multistep manufacturing processes of devices having semiconductor bodies not comprising group 14 or group 13/15 materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
- Formation Of Insulating Films (AREA)
- Silicon Polymers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020125120 | 2020-07-22 | ||
PCT/JP2021/026581 WO2022019205A1 (ja) | 2020-07-22 | 2021-07-15 | 薄膜トランジスタ素子およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022019205A1 true JPWO2022019205A1 (ja) | 2022-01-27 |
Family
ID=79729500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022537962A Pending JPWO2022019205A1 (ja) | 2020-07-22 | 2021-07-15 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230155034A1 (ja) |
JP (1) | JPWO2022019205A1 (ja) |
CN (1) | CN116195039A (ja) |
TW (1) | TW202215538A (ja) |
WO (1) | WO2022019205A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022135945A (ja) * | 2021-03-04 | 2022-09-15 | 東レ株式会社 | 樹脂組成物、樹脂組成物被膜、樹脂組成物フィルム、硬化膜、およびこれらを用いた半導体装置 |
TWI814578B (zh) * | 2022-09-13 | 2023-09-01 | 國立中山大學 | 薄膜電晶體及其製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010258378A (ja) * | 2009-04-28 | 2010-11-11 | Kaneka Corp | 絶縁性薄膜およびそれを用いた薄膜トランジスタ |
JP5813341B2 (ja) * | 2011-03-10 | 2015-11-17 | 株式会社カネカ | 膜形成用組成物および該組成物を用いた薄膜トランジスタ |
DE112012002394T5 (de) * | 2011-06-08 | 2014-02-20 | Semiconductor Energy Laboratory Co., Ltd. | Sputtertarget, Verfahren zum Herstellen eines Sputtertargets und Verfahren zum Bilden eines Dünnfilmes |
TWI565067B (zh) * | 2011-07-08 | 2017-01-01 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
KR102465013B1 (ko) * | 2016-11-28 | 2022-11-09 | 메르크 파텐트 게엠베하 | 보호막을 구비하는 박막 트랜지스터 기판 및 이의 제조방법 |
WO2019144082A1 (en) * | 2018-01-19 | 2019-07-25 | Flexterra, Inc. | Organic dielectric materials and devices including them |
-
2021
- 2021-07-15 CN CN202180060143.XA patent/CN116195039A/zh active Pending
- 2021-07-15 JP JP2022537962A patent/JPWO2022019205A1/ja active Pending
- 2021-07-15 WO PCT/JP2021/026581 patent/WO2022019205A1/ja active Application Filing
- 2021-07-22 TW TW110126922A patent/TW202215538A/zh unknown
-
2023
- 2023-01-20 US US18/157,082 patent/US20230155034A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20230155034A1 (en) | 2023-05-18 |
TW202215538A (zh) | 2022-04-16 |
WO2022019205A1 (ja) | 2022-01-27 |
CN116195039A (zh) | 2023-05-30 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240516 |