JPWO2022004476A1 - - Google Patents
Info
- Publication number
- JPWO2022004476A1 JPWO2022004476A1 JP2022533885A JP2022533885A JPWO2022004476A1 JP WO2022004476 A1 JPWO2022004476 A1 JP WO2022004476A1 JP 2022533885 A JP2022533885 A JP 2022533885A JP 2022533885 A JP2022533885 A JP 2022533885A JP WO2022004476 A1 JPWO2022004476 A1 JP WO2022004476A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
- C09J125/02—Homopolymers or copolymers of hydrocarbons
- C09J125/04—Homopolymers or copolymers of styrene
- C09J125/08—Copolymers of styrene
- C09J125/10—Copolymers of styrene with conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020113800 | 2020-07-01 | ||
| PCT/JP2021/023522 WO2022004476A1 (en) | 2020-07-01 | 2021-06-22 | Adhesive composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022004476A1 true JPWO2022004476A1 (en) | 2022-01-06 |
Family
ID=79316251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022533885A Pending JPWO2022004476A1 (en) | 2020-07-01 | 2021-06-22 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2022004476A1 (en) |
| CN (1) | CN115996999A (en) |
| TW (1) | TWI795825B (en) |
| WO (1) | WO2022004476A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024209940A1 (en) * | 2023-04-06 | 2024-10-10 | Dic株式会社 | Thermosetting adhesive sheet and printed wiring board |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08319466A (en) * | 1995-03-20 | 1996-12-03 | Fujitsu Ltd | Adhesive, semiconductor device, and its production |
| US7005394B1 (en) * | 1998-07-10 | 2006-02-28 | 3M Innovative Properties Company | Tackified thermoplastic-epoxy pressure sensitive adhesives |
| JP3685791B2 (en) * | 2003-08-08 | 2005-08-24 | 日東電工株式会社 | Adhesive sheet for steel plate |
| DE102004031189A1 (en) * | 2004-06-28 | 2006-01-19 | Tesa Ag | Heat-activated and crosslinkable adhesive tape for the bonding of electronic components and printed conductors |
| JP2009132879A (en) * | 2007-11-02 | 2009-06-18 | Toray Ind Inc | Adhesive composition and cover-lay film using the same |
| US10875283B2 (en) * | 2014-07-31 | 2020-12-29 | Toagosei Co., Ltd. | Adhesive layer-equipped laminate, and flexible copper-clad laminate sheet and flexible flat cable using same |
-
2021
- 2021-06-22 WO PCT/JP2021/023522 patent/WO2022004476A1/en active Application Filing
- 2021-06-22 CN CN202180045764.0A patent/CN115996999A/en active Pending
- 2021-06-22 JP JP2022533885A patent/JPWO2022004476A1/ja active Pending
- 2021-06-29 TW TW110123664A patent/TWI795825B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022004476A1 (en) | 2022-01-06 |
| CN115996999A (en) | 2023-04-21 |
| TWI795825B (en) | 2023-03-11 |
| TW202208577A (en) | 2022-03-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231012 |