JPWO2021245912A1 - - Google Patents

Info

Publication number
JPWO2021245912A1
JPWO2021245912A1 JP2020551595A JP2020551595A JPWO2021245912A1 JP WO2021245912 A1 JPWO2021245912 A1 JP WO2021245912A1 JP 2020551595 A JP2020551595 A JP 2020551595A JP 2020551595 A JP2020551595 A JP 2020551595A JP WO2021245912 A1 JPWO2021245912 A1 JP WO2021245912A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020551595A
Other languages
Japanese (ja)
Other versions
JP7152501B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021245912A1 publication Critical patent/JPWO2021245912A1/ja
Application granted granted Critical
Publication of JP7152501B2 publication Critical patent/JP7152501B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Conductive Materials (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2020551595A 2020-06-05 2020-06-05 Via-filled substrate manufacturing method and conductive paste kit Active JP7152501B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/022308 WO2021245912A1 (en) 2020-06-05 2020-06-05 Method for producing filled-via substrate, and conductive paste kit

Publications (2)

Publication Number Publication Date
JPWO2021245912A1 true JPWO2021245912A1 (en) 2021-12-09
JP7152501B2 JP7152501B2 (en) 2022-10-12

Family

ID=78830758

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020551595A Active JP7152501B2 (en) 2020-06-05 2020-06-05 Via-filled substrate manufacturing method and conductive paste kit

Country Status (3)

Country Link
JP (1) JP7152501B2 (en)
CN (1) CN114080868A (en)
WO (1) WO2021245912A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7430670B2 (en) 2020-08-05 2024-02-13 三ツ星ベルト株式会社 Via filling board manufacturing method and conductive paste kit

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002043740A (en) * 2000-07-24 2002-02-08 Matsushita Electric Works Ltd Method for filling metal into through hole in ceramic substrate
JP2012129238A (en) * 2010-12-13 2012-07-05 Tokuyama Corp Ceramic via substrate, metallized ceramic via substrate, and method for manufacturing both
JP2013153051A (en) * 2012-01-25 2013-08-08 Tokuyama Corp Metallized ceramic via substrate and manufacturing method thereof
JP2017063109A (en) * 2015-09-24 2017-03-30 三ツ星ベルト株式会社 Via filling substrate, manufacturing method thereof, and precursor
JP2017069189A (en) * 2015-09-29 2017-04-06 三ツ星ベルト株式会社 Conductive paste and electronic substrate, manufacturing method therefor
JP2018107126A (en) * 2016-12-22 2018-07-05 三ツ星ベルト株式会社 Conductive paste, electronic substrate and manufacturing method therefor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002043740A (en) * 2000-07-24 2002-02-08 Matsushita Electric Works Ltd Method for filling metal into through hole in ceramic substrate
JP2012129238A (en) * 2010-12-13 2012-07-05 Tokuyama Corp Ceramic via substrate, metallized ceramic via substrate, and method for manufacturing both
JP2013153051A (en) * 2012-01-25 2013-08-08 Tokuyama Corp Metallized ceramic via substrate and manufacturing method thereof
JP2017063109A (en) * 2015-09-24 2017-03-30 三ツ星ベルト株式会社 Via filling substrate, manufacturing method thereof, and precursor
JP2017069189A (en) * 2015-09-29 2017-04-06 三ツ星ベルト株式会社 Conductive paste and electronic substrate, manufacturing method therefor
JP2018107126A (en) * 2016-12-22 2018-07-05 三ツ星ベルト株式会社 Conductive paste, electronic substrate and manufacturing method therefor

Also Published As

Publication number Publication date
WO2021245912A1 (en) 2021-12-09
CN114080868A (en) 2022-02-22
JP7152501B2 (en) 2022-10-12

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