JPWO2021241581A1 - - Google Patents
Info
- Publication number
- JPWO2021241581A1 JPWO2021241581A1 JP2022526584A JP2022526584A JPWO2021241581A1 JP WO2021241581 A1 JPWO2021241581 A1 JP WO2021241581A1 JP 2022526584 A JP2022526584 A JP 2022526584A JP 2022526584 A JP2022526584 A JP 2022526584A JP WO2021241581 A1 JPWO2021241581 A1 JP WO2021241581A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020094819 | 2020-05-29 | ||
| JP2020094819 | 2020-05-29 | ||
| PCT/JP2021/019805 WO2021241581A1 (en) | 2020-05-29 | 2021-05-25 | Photosensitive resin composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021241581A1 true JPWO2021241581A1 (en) | 2021-12-02 |
| JPWO2021241581A5 JPWO2021241581A5 (en) | 2022-11-01 |
| JP7211560B2 JP7211560B2 (en) | 2023-01-24 |
Family
ID=78744092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022526584A Active JP7211560B2 (en) | 2020-05-29 | 2021-05-25 | Photosensitive resin composition |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7211560B2 (en) |
| KR (1) | KR20230013084A (en) |
| CN (1) | CN115698855A (en) |
| TW (1) | TW202208474A (en) |
| WO (1) | WO2021241581A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012123378A (en) * | 2010-11-17 | 2012-06-28 | Asahi Kasei E-Materials Corp | Photosensitive resin composition for surface protective film of semiconductor element or interlayer insulating film |
| WO2018088469A1 (en) * | 2016-11-11 | 2018-05-17 | 住友ベークライト株式会社 | Photosensitive resin composition, resin film, cured film, semiconductor device production method, and semiconductor device |
| JP2019053220A (en) * | 2017-09-15 | 2019-04-04 | 住友ベークライト株式会社 | Photosensitive resin composition, semiconductor device and electronic equipment |
| JP2019101052A (en) * | 2017-11-28 | 2019-06-24 | 日立化成株式会社 | Photosensitive resin composition and method for producing circuit board |
| JP2019109425A (en) * | 2017-12-20 | 2019-07-04 | 住友ベークライト株式会社 | Permanent film-forming negative photosensitive resin composition, cured film of the composition and electric-electronic apparatus including the cured film |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007213032A (en) | 2006-01-10 | 2007-08-23 | Hitachi Chemical Dupont Microsystems Ltd | Positive photosensitive resin composition, pattern forming method and electronic component |
-
2021
- 2021-05-25 KR KR1020227044405A patent/KR20230013084A/en not_active Application Discontinuation
- 2021-05-25 JP JP2022526584A patent/JP7211560B2/en active Active
- 2021-05-25 CN CN202180038895.6A patent/CN115698855A/en active Pending
- 2021-05-25 WO PCT/JP2021/019805 patent/WO2021241581A1/en active Application Filing
- 2021-05-28 TW TW110119409A patent/TW202208474A/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012123378A (en) * | 2010-11-17 | 2012-06-28 | Asahi Kasei E-Materials Corp | Photosensitive resin composition for surface protective film of semiconductor element or interlayer insulating film |
| WO2018088469A1 (en) * | 2016-11-11 | 2018-05-17 | 住友ベークライト株式会社 | Photosensitive resin composition, resin film, cured film, semiconductor device production method, and semiconductor device |
| JP2019070832A (en) * | 2016-11-11 | 2019-05-09 | 住友ベークライト株式会社 | Method for manufacturing semiconductor device |
| JP2019053220A (en) * | 2017-09-15 | 2019-04-04 | 住友ベークライト株式会社 | Photosensitive resin composition, semiconductor device and electronic equipment |
| JP2019101052A (en) * | 2017-11-28 | 2019-06-24 | 日立化成株式会社 | Photosensitive resin composition and method for producing circuit board |
| JP2019109425A (en) * | 2017-12-20 | 2019-07-04 | 住友ベークライト株式会社 | Permanent film-forming negative photosensitive resin composition, cured film of the composition and electric-electronic apparatus including the cured film |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021241581A1 (en) | 2021-12-02 |
| JP7211560B2 (en) | 2023-01-24 |
| TW202208474A (en) | 2022-03-01 |
| CN115698855A (en) | 2023-02-03 |
| KR20230013084A (en) | 2023-01-26 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220715 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220715 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20220715 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220823 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20221006 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20221213 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20221226 |
|
| R151 | Written notification of patent or utility model registration |
Ref document number: 7211560 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |