JPWO2021220981A1 - - Google Patents

Info

Publication number
JPWO2021220981A1
JPWO2021220981A1 JP2022518031A JP2022518031A JPWO2021220981A1 JP WO2021220981 A1 JPWO2021220981 A1 JP WO2021220981A1 JP 2022518031 A JP2022518031 A JP 2022518031A JP 2022518031 A JP2022518031 A JP 2022518031A JP WO2021220981 A1 JPWO2021220981 A1 JP WO2021220981A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022518031A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021220981A1 publication Critical patent/JPWO2021220981A1/ja
Priority to JP2024092553A priority Critical patent/JP2024111000A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
JP2022518031A 2020-05-01 2021-04-23 Pending JPWO2021220981A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024092553A JP2024111000A (ja) 2020-05-01 2024-06-06 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法及びタッチパネルの製造方法、並びに、ポリエチレンテレフタレートフィルム

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020081212 2020-05-01
JP2020171962 2020-10-12
JP2020207767 2020-12-15
PCT/JP2021/016523 WO2021220981A1 (ja) 2020-05-01 2021-04-23 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法及びタッチパネルの製造方法、並びに、ポリエチレンテレフタレートフィルム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024092553A Division JP2024111000A (ja) 2020-05-01 2024-06-06 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法及びタッチパネルの製造方法、並びに、ポリエチレンテレフタレートフィルム

Publications (1)

Publication Number Publication Date
JPWO2021220981A1 true JPWO2021220981A1 (zh) 2021-11-04

Family

ID=78373195

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022518031A Pending JPWO2021220981A1 (zh) 2020-05-01 2021-04-23
JP2024092553A Pending JP2024111000A (ja) 2020-05-01 2024-06-06 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法及びタッチパネルの製造方法、並びに、ポリエチレンテレフタレートフィルム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024092553A Pending JP2024111000A (ja) 2020-05-01 2024-06-06 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法及びタッチパネルの製造方法、並びに、ポリエチレンテレフタレートフィルム

Country Status (3)

Country Link
JP (2) JPWO2021220981A1 (zh)
CN (1) CN115485623A (zh)
WO (1) WO2021220981A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240110652A (ko) * 2021-12-27 2024-07-15 후지필름 가부시키가이샤 레지스트 패턴의 제조 방법, 적층체의 제조 방법, 및, 다이렉트 이미징 노광용 감광성 전사 재료

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019101405A (ja) * 2017-12-04 2019-06-24 旭化成株式会社 感光性樹脂積層体ロール
WO2019124452A1 (ja) * 2017-12-20 2019-06-27 旭化成株式会社 感光性樹脂積層体

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7030828B2 (ja) * 2017-09-29 2022-03-07 富士フイルム株式会社 感光性転写材料、回路配線の製造方法及びタッチパネルの製造方法
CN111989618A (zh) * 2018-04-18 2020-11-24 三菱化学株式会社 干膜抗蚀剂用聚酯薄膜

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019101405A (ja) * 2017-12-04 2019-06-24 旭化成株式会社 感光性樹脂積層体ロール
WO2019124452A1 (ja) * 2017-12-20 2019-06-27 旭化成株式会社 感光性樹脂積層体

Also Published As

Publication number Publication date
WO2021220981A1 (ja) 2021-11-04
JP2024111000A (ja) 2024-08-16
CN115485623A (zh) 2022-12-16

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