JPWO2021205909A1 - - Google Patents
Info
- Publication number
- JPWO2021205909A1 JPWO2021205909A1 JP2022514409A JP2022514409A JPWO2021205909A1 JP WO2021205909 A1 JPWO2021205909 A1 JP WO2021205909A1 JP 2022514409 A JP2022514409 A JP 2022514409A JP 2022514409 A JP2022514409 A JP 2022514409A JP WO2021205909 A1 JPWO2021205909 A1 JP WO2021205909A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020069015 | 2020-04-07 | ||
| JP2020069015 | 2020-04-07 | ||
| PCT/JP2021/012988 WO2021205909A1 (en) | 2020-04-07 | 2021-03-26 | Substrate processing method, and substrate processing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021205909A1 true JPWO2021205909A1 (en) | 2021-10-14 |
| JP7309048B2 JP7309048B2 (en) | 2023-07-14 |
Family
ID=78023346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022514409A Active JP7309048B2 (en) | 2020-04-07 | 2021-03-26 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7309048B2 (en) |
| TW (1) | TW202205409A (en) |
| WO (1) | WO2021205909A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997012392A1 (en) * | 1995-09-27 | 1997-04-03 | Komatsu Ltd. | Process for cleaning and drying semiconductors and equipment therfor |
| JPH09153475A (en) * | 1995-09-27 | 1997-06-10 | Komatsu Ltd | Semiconductor cleaning/drying method and device |
| JP2001291698A (en) * | 2000-04-10 | 2001-10-19 | Nec Corp | Apparatus for treatment and method therefor |
| KR20080012635A (en) * | 2006-08-04 | 2008-02-12 | 삼성전자주식회사 | Method of drying substrate, and apparatus for performing the same |
| JP2019140401A (en) * | 2019-04-10 | 2019-08-22 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing method |
-
2021
- 2021-03-24 TW TW110110512A patent/TW202205409A/en unknown
- 2021-03-26 WO PCT/JP2021/012988 patent/WO2021205909A1/en active Application Filing
- 2021-03-26 JP JP2022514409A patent/JP7309048B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997012392A1 (en) * | 1995-09-27 | 1997-04-03 | Komatsu Ltd. | Process for cleaning and drying semiconductors and equipment therfor |
| JPH09153475A (en) * | 1995-09-27 | 1997-06-10 | Komatsu Ltd | Semiconductor cleaning/drying method and device |
| JP2001291698A (en) * | 2000-04-10 | 2001-10-19 | Nec Corp | Apparatus for treatment and method therefor |
| KR20080012635A (en) * | 2006-08-04 | 2008-02-12 | 삼성전자주식회사 | Method of drying substrate, and apparatus for performing the same |
| JP2019140401A (en) * | 2019-04-10 | 2019-08-22 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021205909A1 (en) | 2021-10-14 |
| JP7309048B2 (en) | 2023-07-14 |
| TW202205409A (en) | 2022-02-01 |
Similar Documents
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