JPWO2021205760A1 - - Google Patents

Info

Publication number
JPWO2021205760A1
JPWO2021205760A1 JP2022514327A JP2022514327A JPWO2021205760A1 JP WO2021205760 A1 JPWO2021205760 A1 JP WO2021205760A1 JP 2022514327 A JP2022514327 A JP 2022514327A JP 2022514327 A JP2022514327 A JP 2022514327A JP WO2021205760 A1 JPWO2021205760 A1 JP WO2021205760A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022514327A
Other languages
Japanese (ja)
Other versions
JPWO2021205760A5 (en
JP7212300B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021205760A1 publication Critical patent/JPWO2021205760A1/ja
Publication of JPWO2021205760A5 publication Critical patent/JPWO2021205760A5/ja
Application granted granted Critical
Publication of JP7212300B2 publication Critical patent/JP7212300B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
JP2022514327A 2020-04-10 2021-02-19 Solder alloys, solder powders, solder pastes, solder balls, solder preforms and solder joints Active JP7212300B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020071024 2020-04-10
JP2020071024 2020-04-10
PCT/JP2021/006450 WO2021205760A1 (en) 2020-04-10 2021-02-19 Solder alloy, solder powder, solder paste, solder ball, solder preform, and solder joint

Publications (3)

Publication Number Publication Date
JPWO2021205760A1 true JPWO2021205760A1 (en) 2021-10-14
JPWO2021205760A5 JPWO2021205760A5 (en) 2022-11-22
JP7212300B2 JP7212300B2 (en) 2023-01-25

Family

ID=78023297

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022514327A Active JP7212300B2 (en) 2020-04-10 2021-02-19 Solder alloys, solder powders, solder pastes, solder balls, solder preforms and solder joints

Country Status (5)

Country Link
JP (1) JP7212300B2 (en)
KR (1) KR102587716B1 (en)
CN (1) CN115768591A (en)
TW (1) TWI782423B (en)
WO (1) WO2021205760A1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005103645A (en) * 2004-10-29 2005-04-21 Hitachi Metals Ltd Solder ball and its manufacturing method
JP4472752B2 (en) * 2005-07-01 2010-06-02 日鉱金属株式会社 High purity tin or tin alloy and method for producing high purity tin
JP5019764B2 (en) * 2006-03-09 2012-09-05 新日鉄マテリアルズ株式会社 Lead-free solder alloys, solder balls and electronic components
JP2017113756A (en) * 2015-12-21 2017-06-29 住友金属鉱山株式会社 SOLDER ALLOY INCLUDING Sn EXCELLENT IN SURFACE PROPERTY AS MAIN COMPONENT, AND SELECTION METHOD THEREFOR
JP6540869B1 (en) * 2018-03-30 2019-07-10 千住金属工業株式会社 Solder paste
JP2020055037A (en) * 2018-09-28 2020-04-09 荒川化学工業株式会社 Lead-free solder flux, and lead-free solder paste

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5019764B1 (en) * 1971-04-30 1975-07-09
JP2005040847A (en) * 2003-07-25 2005-02-17 Hitachi Metals Ltd Manufacturing method of solder bowl
WO2012127642A1 (en) * 2011-03-23 2012-09-27 千住金属工業株式会社 Lead-free solder alloy
ES2796866T3 (en) * 2013-04-09 2020-11-30 Senju Metal Industry Co Solder paste
JP6717559B2 (en) 2013-10-16 2020-07-01 三井金属鉱業株式会社 Solder alloy and solder powder
JP5534122B1 (en) * 2014-02-04 2014-06-25 千住金属工業株式会社 Core ball, solder paste, foam solder, flux coated core ball and solder joint
US10518362B2 (en) * 2015-07-24 2019-12-31 Harima Chemicals, Incorporated Solder alloy, solder paste, and electronic circuit board
MX2018011176A (en) * 2016-03-22 2019-03-28 Tamura Seisakusho Kk Lead-free solder alloy, flux composition, solder paste composition, electronic circuit board and electronic control device.
TWI677580B (en) * 2017-03-31 2019-11-21 日商千住金屬工業股份有限公司 Solder alloy, solder paste and solder joint
JP6521161B1 (en) * 2018-07-20 2019-05-29 千住金属工業株式会社 Solder alloy, solder powder, solder paste, and solder joint using them
JP2020011293A (en) * 2019-04-11 2020-01-23 千住金属工業株式会社 Solder alloy, solder powder, solder paste, and solder joint with use thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005103645A (en) * 2004-10-29 2005-04-21 Hitachi Metals Ltd Solder ball and its manufacturing method
JP4472752B2 (en) * 2005-07-01 2010-06-02 日鉱金属株式会社 High purity tin or tin alloy and method for producing high purity tin
JP5296269B1 (en) * 2005-07-01 2013-09-25 Ｊｘ日鉱日石金属株式会社 High purity tin alloy
JP5019764B2 (en) * 2006-03-09 2012-09-05 新日鉄マテリアルズ株式会社 Lead-free solder alloys, solder balls and electronic components
JP2017113756A (en) * 2015-12-21 2017-06-29 住友金属鉱山株式会社 SOLDER ALLOY INCLUDING Sn EXCELLENT IN SURFACE PROPERTY AS MAIN COMPONENT, AND SELECTION METHOD THEREFOR
JP6540869B1 (en) * 2018-03-30 2019-07-10 千住金属工業株式会社 Solder paste
JP2020055037A (en) * 2018-09-28 2020-04-09 荒川化学工業株式会社 Lead-free solder flux, and lead-free solder paste

Also Published As

Publication number Publication date
TWI782423B (en) 2022-11-01
KR102587716B1 (en) 2023-10-12
TW202142347A (en) 2021-11-16
JP7212300B2 (en) 2023-01-25
WO2021205760A1 (en) 2021-10-14
KR20220149610A (en) 2022-11-08
CN115768591A (en) 2023-03-07

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