JPWO2021200867A1 - - Google Patents

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Publication number
JPWO2021200867A1
JPWO2021200867A1 JP2022512241A JP2022512241A JPWO2021200867A1 JP WO2021200867 A1 JPWO2021200867 A1 JP WO2021200867A1 JP 2022512241 A JP2022512241 A JP 2022512241A JP 2022512241 A JP2022512241 A JP 2022512241A JP WO2021200867 A1 JPWO2021200867 A1 JP WO2021200867A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022512241A
Other versions
JP7573023B2 (ja
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Publication of JPWO2021200867A1 publication Critical patent/JPWO2021200867A1/ja
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Publication of JP7573023B2 publication Critical patent/JP7573023B2/ja
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
JP2022512241A 2020-03-30 2021-03-29 窒化ケイ素板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法 Active JP7573023B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020060858 2020-03-30
JP2020060858 2020-03-30
PCT/JP2021/013393 WO2021200867A1 (ja) 2020-03-30 2021-03-29 窒化ケイ素板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2021200867A1 true JPWO2021200867A1 (ja) 2021-10-07
JP7573023B2 JP7573023B2 (ja) 2024-10-24

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Publication number Publication date
WO2021200867A1 (ja) 2021-10-07

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