JPWO2021200867A1 - - Google Patents
Info
- Publication number
- JPWO2021200867A1 JPWO2021200867A1 JP2022512241A JP2022512241A JPWO2021200867A1 JP WO2021200867 A1 JPWO2021200867 A1 JP WO2021200867A1 JP 2022512241 A JP2022512241 A JP 2022512241A JP 2022512241 A JP2022512241 A JP 2022512241A JP WO2021200867 A1 JPWO2021200867 A1 JP WO2021200867A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020060858 | 2020-03-30 | ||
JP2020060858 | 2020-03-30 | ||
PCT/JP2021/013393 WO2021200867A1 (ja) | 2020-03-30 | 2021-03-29 | 窒化ケイ素板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021200867A1 true JPWO2021200867A1 (ja) | 2021-10-07 |
JP7573023B2 JP7573023B2 (ja) | 2024-10-24 |
Family
ID=
Also Published As
Publication number | Publication date |
---|---|
WO2021200867A1 (ja) | 2021-10-07 |
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