JPWO2021176526A1 - - Google Patents

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Publication number
JPWO2021176526A1
JPWO2021176526A1 JP2021537866A JP2021537866A JPWO2021176526A1 JP WO2021176526 A1 JPWO2021176526 A1 JP WO2021176526A1 JP 2021537866 A JP2021537866 A JP 2021537866A JP 2021537866 A JP2021537866 A JP 2021537866A JP WO2021176526 A1 JPWO2021176526 A1 JP WO2021176526A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021537866A
Other languages
Japanese (ja)
Other versions
JP7164136B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021176526A1 publication Critical patent/JPWO2021176526A1/ja
Application granted granted Critical
Publication of JP7164136B2 publication Critical patent/JP7164136B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/60—Preliminary treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/06—Severing by using heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
JP2021537866A 2020-03-02 2020-03-02 Laser cutting method Active JP7164136B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/008713 WO2021176526A1 (en) 2020-03-02 2020-03-02 Laser cleaving method

Publications (2)

Publication Number Publication Date
JPWO2021176526A1 true JPWO2021176526A1 (en) 2021-09-10
JP7164136B2 JP7164136B2 (en) 2022-11-01

Family

ID=77613965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021537866A Active JP7164136B2 (en) 2020-03-02 2020-03-02 Laser cutting method

Country Status (2)

Country Link
JP (1) JP7164136B2 (en)
WO (1) WO2021176526A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007301631A (en) * 2006-05-15 2007-11-22 Shibaura Mechatronics Corp Cleaving apparatus and cleaving method
JP2010089144A (en) * 2008-10-10 2010-04-22 Mitsuboshi Diamond Industrial Co Ltd Method for cutting brittle material substrate
JP2011011972A (en) * 2009-06-05 2011-01-20 Lemi Ltd Apparatus for cutting brittle material and method of cutting brittle material
JP2019042925A (en) * 2015-02-03 2019-03-22 セントラル硝子株式会社 Method of cutting brittle material, device for cutting brittle material, method of manufacturing cut brittle material, and cut brittle material

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BRPI1008737B1 (en) * 2009-02-25 2019-10-29 Nichia Corp method for fabricating semiconductor element

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007301631A (en) * 2006-05-15 2007-11-22 Shibaura Mechatronics Corp Cleaving apparatus and cleaving method
JP2010089144A (en) * 2008-10-10 2010-04-22 Mitsuboshi Diamond Industrial Co Ltd Method for cutting brittle material substrate
JP2011011972A (en) * 2009-06-05 2011-01-20 Lemi Ltd Apparatus for cutting brittle material and method of cutting brittle material
JP2019042925A (en) * 2015-02-03 2019-03-22 セントラル硝子株式会社 Method of cutting brittle material, device for cutting brittle material, method of manufacturing cut brittle material, and cut brittle material

Also Published As

Publication number Publication date
WO2021176526A1 (en) 2021-09-10
JP7164136B2 (en) 2022-11-01

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