JPWO2021171808A1 - - Google Patents

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Publication number
JPWO2021171808A1
JPWO2021171808A1 JP2022503136A JP2022503136A JPWO2021171808A1 JP WO2021171808 A1 JPWO2021171808 A1 JP WO2021171808A1 JP 2022503136 A JP2022503136 A JP 2022503136A JP 2022503136 A JP2022503136 A JP 2022503136A JP WO2021171808 A1 JPWO2021171808 A1 JP WO2021171808A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022503136A
Other languages
Japanese (ja)
Other versions
JP7394956B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021171808A1 publication Critical patent/JPWO2021171808A1/ja
Application granted granted Critical
Publication of JP7394956B2 publication Critical patent/JP7394956B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/20—Electrolytic after-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/006—Nanostructures, e.g. using aluminium anodic oxidation templates [AAO]
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/24—Chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
JP2022503136A 2020-02-26 2021-01-13 Metal-filled microstructure and method for manufacturing metal-filled microstructure Active JP7394956B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020030735 2020-02-26
JP2020030735 2020-02-26
PCT/JP2021/000775 WO2021171808A1 (en) 2020-02-26 2021-01-13 Metal-filled microstructure, production method for metal-filled microstructure, and structure

Publications (2)

Publication Number Publication Date
JPWO2021171808A1 true JPWO2021171808A1 (en) 2021-09-02
JP7394956B2 JP7394956B2 (en) 2023-12-08

Family

ID=77490450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022503136A Active JP7394956B2 (en) 2020-02-26 2021-01-13 Metal-filled microstructure and method for manufacturing metal-filled microstructure

Country Status (5)

Country Link
JP (1) JP7394956B2 (en)
KR (1) KR20220130202A (en)
CN (1) CN115135809A (en)
TW (1) TW202202657A (en)
WO (1) WO2021171808A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021033467A1 (en) * 2019-08-16 2021-02-25 富士フイルム株式会社 Method for producing structure
KR20230077866A (en) * 2021-11-26 2023-06-02 (주)포인트엔지니어링 Anodic oxidation structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06334087A (en) * 1993-05-21 1994-12-02 Hitachi Cable Ltd Manufacture of lead frame for semiconductor device
JP2012224944A (en) * 2011-04-08 2012-11-15 Ebara Corp Electroplating method
WO2017057150A1 (en) * 2015-09-29 2017-04-06 富士フイルム株式会社 Method for manufacturing metal-filled microstructure device
JP2019149448A (en) * 2018-02-27 2019-09-05 富士フイルム株式会社 Anisotropic conductive member, manufacturing method of anisotropic conductive member, joint body, and electronic device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1046382A (en) * 1996-07-26 1998-02-17 Mitsubishi Materials Corp Production of fine metallic fiber and conductive paint using the fiber
EP3040450A4 (en) * 2013-08-30 2016-08-31 Fujifilm Corp Method for manufacturing metal-filled microstructure
JP6084709B2 (en) * 2014-01-27 2017-02-22 富士フイルム株式会社 MICROSTRUCTURE, MULTILAYER WIRING BOARD, SEMICONDUCTOR PACKAGE, AND MICROSTRUCTURE MANUFACTURING METHOD
US9617648B2 (en) 2015-03-04 2017-04-11 Lam Research Corporation Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06334087A (en) * 1993-05-21 1994-12-02 Hitachi Cable Ltd Manufacture of lead frame for semiconductor device
JP2012224944A (en) * 2011-04-08 2012-11-15 Ebara Corp Electroplating method
WO2017057150A1 (en) * 2015-09-29 2017-04-06 富士フイルム株式会社 Method for manufacturing metal-filled microstructure device
JP2019149448A (en) * 2018-02-27 2019-09-05 富士フイルム株式会社 Anisotropic conductive member, manufacturing method of anisotropic conductive member, joint body, and electronic device

Also Published As

Publication number Publication date
JP7394956B2 (en) 2023-12-08
KR20220130202A (en) 2022-09-26
TW202202657A (en) 2022-01-16
WO2021171808A1 (en) 2021-09-02
CN115135809A (en) 2022-09-30

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