JPWO2021149727A1 - - Google Patents
Info
- Publication number
- JPWO2021149727A1 JPWO2021149727A1 JP2021572768A JP2021572768A JPWO2021149727A1 JP WO2021149727 A1 JPWO2021149727 A1 JP WO2021149727A1 JP 2021572768 A JP2021572768 A JP 2021572768A JP 2021572768 A JP2021572768 A JP 2021572768A JP WO2021149727 A1 JPWO2021149727 A1 JP WO2021149727A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020009046 | 2020-01-23 | ||
| PCT/JP2021/001867 WO2021149727A1 (en) | 2020-01-23 | 2021-01-20 | Sealing resin composition, electronic component device, and method for manufacturing electronic component device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021149727A1 true JPWO2021149727A1 (en) | 2021-07-29 |
Family
ID=76991775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021572768A Pending JPWO2021149727A1 (en) | 2020-01-23 | 2021-01-20 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2021149727A1 (en) |
| KR (1) | KR20220131239A (en) |
| CN (1) | CN115004357A (en) |
| TW (1) | TW202136467A (en) |
| WO (1) | WO2021149727A1 (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5309415B2 (en) | 2005-03-03 | 2013-10-09 | 日立化成株式会社 | Epoxy resin molding material for sealing and electronic component device |
| JP7154732B2 (en) * | 2016-03-31 | 2022-10-18 | 味の素株式会社 | resin composition |
| JP7046477B2 (en) * | 2016-07-01 | 2022-04-04 | 味の素株式会社 | Resin composition |
| JP7102093B2 (en) * | 2016-09-28 | 2022-07-19 | 味の素株式会社 | Resin composition, resin sheet, circuit board and semiconductor chip package |
| JP2018133535A (en) * | 2017-02-17 | 2018-08-23 | 日立化成株式会社 | Encapsulation material for wlp structure optical semiconductor element, wlp, wlp structure optical semiconductor device, and method of manufacturing optical semiconductor device |
| JP2019029530A (en) * | 2017-07-31 | 2019-02-21 | 日立化成株式会社 | Optical semiconductor device and mobile liquid crystal backlight |
-
2021
- 2021-01-20 CN CN202180010375.4A patent/CN115004357A/en active Pending
- 2021-01-20 JP JP2021572768A patent/JPWO2021149727A1/ja active Pending
- 2021-01-20 WO PCT/JP2021/001867 patent/WO2021149727A1/en active Application Filing
- 2021-01-20 KR KR1020227024757A patent/KR20220131239A/en active Search and Examination
- 2021-01-21 TW TW110102303A patent/TW202136467A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202136467A (en) | 2021-10-01 |
| CN115004357A (en) | 2022-09-02 |
| WO2021149727A1 (en) | 2021-07-29 |
| KR20220131239A (en) | 2022-09-27 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231109 |