JPWO2021149380A1 - - Google Patents

Info

Publication number
JPWO2021149380A1
JPWO2021149380A1 JP2021572994A JP2021572994A JPWO2021149380A1 JP WO2021149380 A1 JPWO2021149380 A1 JP WO2021149380A1 JP 2021572994 A JP2021572994 A JP 2021572994A JP 2021572994 A JP2021572994 A JP 2021572994A JP WO2021149380 A1 JPWO2021149380 A1 JP WO2021149380A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021572994A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021149380A1 publication Critical patent/JPWO2021149380A1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
JP2021572994A 2020-01-24 2020-12-08 Pending JPWO2021149380A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020009955 2020-01-24
PCT/JP2020/045690 WO2021149380A1 (en) 2020-01-24 2020-12-08 Imaging device, method for manufacturing imaging device, and electronic apparatus

Publications (1)

Publication Number Publication Date
JPWO2021149380A1 true JPWO2021149380A1 (en) 2021-07-29

Family

ID=76991687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021572994A Pending JPWO2021149380A1 (en) 2020-01-24 2020-12-08

Country Status (2)

Country Link
JP (1) JPWO2021149380A1 (en)
WO (1) WO2021149380A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023074215A1 (en) * 2021-10-28 2023-05-04 ソニーセミコンダクタソリューションズ株式会社 Semiconductor device and imaging device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4682407A (en) * 1986-01-21 1987-07-28 Motorola, Inc. Means and method for stabilizing polycrystalline semiconductor layers
JPH01173713A (en) * 1987-12-28 1989-07-10 Mitsubishi Electric Corp Semiconductor device
JPH1098187A (en) * 1996-09-20 1998-04-14 Nec Corp Manufacture of semiconductor device
JPH11214683A (en) * 1998-01-26 1999-08-06 Mitsubishi Electric Corp Manufacture of semiconductor device and the semiconductor device
JP2000031475A (en) * 1998-07-10 2000-01-28 Mitsubishi Electric Corp Semiconductor device and its manufacture
JP3180781B2 (en) * 1998-10-22 2001-06-25 日本電気株式会社 Method for manufacturing MOS type semiconductor device
JP3267257B2 (en) * 1998-12-16 2002-03-18 日本電気株式会社 Method for manufacturing semiconductor device
JP2001210593A (en) * 2000-01-24 2001-08-03 Fuji Film Microdevices Co Ltd Method for forming polycrystalline silicone film and semiconductor device
JP2003037266A (en) * 2001-07-25 2003-02-07 Toshiba Corp Semiconductor device and manufacturing method therefor
JP5515434B2 (en) * 2009-06-03 2014-06-11 ソニー株式会社 Semiconductor device and manufacturing method thereof, solid-state imaging device
JP5581954B2 (en) * 2010-10-07 2014-09-03 ソニー株式会社 Solid-state imaging device, method for manufacturing solid-state imaging device, and electronic apparatus
JP2016039315A (en) * 2014-08-08 2016-03-22 株式会社東芝 Solid state image sensor

Also Published As

Publication number Publication date
WO2021149380A1 (en) 2021-07-29

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Legal Events

Date Code Title Description
A621 Written request for application examination

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Effective date: 20231012