JPWO2021132578A1 - - Google Patents

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Publication number
JPWO2021132578A1
JPWO2021132578A1 JP2021567682A JP2021567682A JPWO2021132578A1 JP WO2021132578 A1 JPWO2021132578 A1 JP WO2021132578A1 JP 2021567682 A JP2021567682 A JP 2021567682A JP 2021567682 A JP2021567682 A JP 2021567682A JP WO2021132578 A1 JPWO2021132578 A1 JP WO2021132578A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021567682A
Other languages
Japanese (ja)
Other versions
JP7334268B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021132578A1 publication Critical patent/JPWO2021132578A1/ja
Application granted granted Critical
Publication of JP7334268B2 publication Critical patent/JP7334268B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2021567682A 2019-12-27 2020-12-25 Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device Active JP7334268B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019238513 2019-12-27
JP2019238513 2019-12-27
PCT/JP2020/048779 WO2021132578A1 (en) 2019-12-27 2020-12-25 Curable resin composition, cured film, layered product, method for producing cured film, and semiconductor device

Publications (2)

Publication Number Publication Date
JPWO2021132578A1 true JPWO2021132578A1 (en) 2021-07-01
JP7334268B2 JP7334268B2 (en) 2023-08-28

Family

ID=76573182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021567682A Active JP7334268B2 (en) 2019-12-27 2020-12-25 Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device

Country Status (5)

Country Link
JP (1) JP7334268B2 (en)
KR (1) KR20220107008A (en)
CN (1) CN114981360A (en)
TW (1) TW202130705A (en)
WO (1) WO2021132578A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113480566A (en) * 2021-07-22 2021-10-08 广州星光有机硅科技有限公司 Organic silicon monomer containing diphenylmethane and ultrahigh-refractive-index semiconductor LED packaging material prepared from organic silicon monomer
WO2023106101A1 (en) * 2021-12-09 2023-06-15 日産化学株式会社 Resin composition

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009283711A (en) * 2008-05-22 2009-12-03 Hitachi Chemical Dupont Microsystems Ltd Semiconductor device and manufacturing method therefor, photosensitive-resin composition and electronic component
WO2017104672A1 (en) * 2015-12-17 2017-06-22 富士フイルム株式会社 Method for producing heterocycle-containing polymer precursor, heterocycle-containing polymer precursor, and use for same
WO2018043467A1 (en) * 2016-08-31 2018-03-08 富士フイルム株式会社 Resin composition and application of same
WO2018221457A1 (en) * 2017-05-31 2018-12-06 富士フイルム株式会社 Photosensitive resin composition, polymeric precursor, cured film, laminate, cured film production method, and semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5620691B2 (en) 2010-02-16 2014-11-05 旭化成イーマテリアルズ株式会社 Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009283711A (en) * 2008-05-22 2009-12-03 Hitachi Chemical Dupont Microsystems Ltd Semiconductor device and manufacturing method therefor, photosensitive-resin composition and electronic component
WO2017104672A1 (en) * 2015-12-17 2017-06-22 富士フイルム株式会社 Method for producing heterocycle-containing polymer precursor, heterocycle-containing polymer precursor, and use for same
WO2018043467A1 (en) * 2016-08-31 2018-03-08 富士フイルム株式会社 Resin composition and application of same
WO2018221457A1 (en) * 2017-05-31 2018-12-06 富士フイルム株式会社 Photosensitive resin composition, polymeric precursor, cured film, laminate, cured film production method, and semiconductor device

Also Published As

Publication number Publication date
JP7334268B2 (en) 2023-08-28
WO2021132578A1 (en) 2021-07-01
KR20220107008A (en) 2022-08-01
CN114981360A (en) 2022-08-30
TW202130705A (en) 2021-08-16

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