JPWO2021132383A1 - - Google Patents

Info

Publication number
JPWO2021132383A1
JPWO2021132383A1 JP2021567570A JP2021567570A JPWO2021132383A1 JP WO2021132383 A1 JPWO2021132383 A1 JP WO2021132383A1 JP 2021567570 A JP2021567570 A JP 2021567570A JP 2021567570 A JP2021567570 A JP 2021567570A JP WO2021132383 A1 JPWO2021132383 A1 JP WO2021132383A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021567570A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021132383A1 publication Critical patent/JPWO2021132383A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/02—Polyureas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C08K5/42—Sulfonic acids; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/02—Polyureas
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
JP2021567570A 2019-12-25 2020-12-23 Pending JPWO2021132383A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019234256 2019-12-25
PCT/JP2020/048260 WO2021132383A1 (en) 2019-12-25 2020-12-23 Composition for forming release layer, and release layer

Publications (1)

Publication Number Publication Date
JPWO2021132383A1 true JPWO2021132383A1 (en) 2021-07-01

Family

ID=76574275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021567570A Pending JPWO2021132383A1 (en) 2019-12-25 2020-12-23

Country Status (5)

Country Link
JP (1) JPWO2021132383A1 (en)
KR (1) KR20220120621A (en)
CN (1) CN114945633A (en)
TW (1) TW202136419A (en)
WO (1) WO2021132383A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230154052A (en) * 2021-03-03 2023-11-07 닛산 가가쿠 가부시키가이샤 Composition for forming a peeling layer and a peeling layer

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201502808UA (en) 2006-10-12 2015-05-28 Cambrios Technologies Corp Nanowire-Based Transparent Conductors And Applications Thereof
JP2009205924A (en) 2008-02-27 2009-09-10 Kuraray Co Ltd Transparent conductive film, transparent conductive member, and silver nano wire dispersion solution and manufacturing method of transparent conductive film
JP2009283410A (en) 2008-05-26 2009-12-03 Alps Electric Co Ltd Organic substrate with organic transparent conductive film and its manufacturing method
WO2010074075A1 (en) * 2008-12-26 2010-07-01 日産化学工業株式会社 Additive for composition for forming resist underlayer film and composition for forming resist underlayer film comprising the same
US9198298B2 (en) 2011-04-26 2015-11-24 Nippon Mektron, Ltd. Method for manufacturing transparent printed circuit and method for manufacturing transparent touch panel
CN103717630B (en) * 2011-09-05 2016-08-24 日产化学工业株式会社 Resin combination
KR102064277B1 (en) 2013-08-12 2020-01-13 동우 화인켐 주식회사 Preparing method for flexible touch screen panel
JP5661959B1 (en) 2014-03-03 2015-01-28 ユニチカ株式会社 Transparent sheet, and touch panel and electronic device including the same
US9649594B2 (en) 2015-03-27 2017-05-16 General Electric Technology Gmbh Dual injection grid arrangement
JP2017014377A (en) 2015-06-30 2017-01-19 Ｊｘエネルギー株式会社 Polyimide film, organic electroluminescent element, transparent conductive laminate, touch panel, solar cell and display device
TWI737781B (en) * 2016-08-03 2021-09-01 日商日產化學工業股份有限公司 Composition for forming peeling layer and peeling layer
JP7092132B2 (en) * 2017-07-27 2022-06-28 日産化学株式会社 A composition for forming a release layer and a release layer

Also Published As

Publication number Publication date
WO2021132383A1 (en) 2021-07-01
KR20220120621A (en) 2022-08-30
TW202136419A (en) 2021-10-01
CN114945633A (en) 2022-08-26

Similar Documents

Publication Publication Date Title
BR112021017339A2 (en)
BR112021018450A2 (en)
BR112021017939A2 (en)
BR112021017892A2 (en)
BR112021017738A2 (en)
BR112021017782A2 (en)
BR112021018168A2 (en)
BR112021017728A2 (en)
BR112021017234A2 (en)
BR112021017355A2 (en)
BR112021018102A2 (en)
BR112021017173A2 (en)
BR112021017083A2 (en)
BR112021017637A2 (en)
BR112021018452A2 (en)
BR112021018250A2 (en)
BR112021018084A2 (en)
BR112021018093A2 (en)
BR112021018484A2 (en)
BR112021017732A2 (en)
JPWO2021132383A1 (en)
BR112021015080A2 (en)
BR112021017949A2 (en)
BR112021017983A2 (en)
BR112021017703A2 (en)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231129