JPWO2021131790A1 - - Google Patents

Info

Publication number
JPWO2021131790A1
JPWO2021131790A1 JP2021567238A JP2021567238A JPWO2021131790A1 JP WO2021131790 A1 JPWO2021131790 A1 JP WO2021131790A1 JP 2021567238 A JP2021567238 A JP 2021567238A JP 2021567238 A JP2021567238 A JP 2021567238A JP WO2021131790 A1 JPWO2021131790 A1 JP WO2021131790A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021567238A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021131790A1 publication Critical patent/JPWO2021131790A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F16/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
    • C08F16/12—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an ether radical
    • C08F16/14—Monomers containing only one unsaturated aliphatic radical
    • C08F16/16—Monomers containing no hetero atoms other than the ether oxygen
    • C08F16/18—Acyclic compounds
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Epoxy Resins (AREA)
  • Electroluminescent Light Sources (AREA)
JP2021567238A 2019-12-27 2020-12-11 Pending JPWO2021131790A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019238076 2019-12-27
PCT/JP2020/046269 WO2021131790A1 (fr) 2019-12-27 2020-12-11 Composition durcissable et dispositif d'affichage électroluminescent organique

Publications (1)

Publication Number Publication Date
JPWO2021131790A1 true JPWO2021131790A1 (fr) 2021-07-01

Family

ID=76576052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021567238A Pending JPWO2021131790A1 (fr) 2019-12-27 2020-12-11

Country Status (5)

Country Link
JP (1) JPWO2021131790A1 (fr)
KR (1) KR20220111301A (fr)
CN (1) CN114902804A (fr)
TW (1) TW202126760A (fr)
WO (1) WO2021131790A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202413476A (zh) * 2022-07-07 2024-04-01 日商積水化學工業股份有限公司 硬化性樹脂組成物及有機el顯示元件用密封劑

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101930991A (zh) * 2010-03-09 2010-12-29 电子科技大学 一种有源驱动有机电致发光器件及其制备方法
CN102299119A (zh) * 2011-05-20 2011-12-28 电子科技大学 一种光电子器件的封装方法
JP2013091676A (ja) * 2011-10-24 2013-05-16 Panasonic Corp 新規ｕｖ硬化性樹脂組成物
JP2015110762A (ja) * 2013-10-31 2015-06-18 三洋化成工業株式会社 活性光線硬化型接着剤組成物
US20170029674A1 (en) * 2015-07-30 2017-02-02 Boe Technology Group Co., Ltd. Sealant composition and method for curing the same, display device and sealing method, and use thereof
WO2020067827A1 (fr) * 2018-09-28 2020-04-02 주식회사 엘지화학 Composition de matériau d'étanchéité

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5554114B2 (ja) 2010-03-29 2014-07-23 富士フイルム株式会社 活性放射線硬化型インクジェット用インク組成物、印刷物、印刷物の製造方法、印刷物成形体、及び印刷物成形体の製造方法
KR102507270B1 (ko) * 2018-12-07 2023-03-07 주식회사 엘지화학 밀봉재 조성물

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101930991A (zh) * 2010-03-09 2010-12-29 电子科技大学 一种有源驱动有机电致发光器件及其制备方法
CN102299119A (zh) * 2011-05-20 2011-12-28 电子科技大学 一种光电子器件的封装方法
JP2013091676A (ja) * 2011-10-24 2013-05-16 Panasonic Corp 新規ｕｖ硬化性樹脂組成物
JP2015110762A (ja) * 2013-10-31 2015-06-18 三洋化成工業株式会社 活性光線硬化型接着剤組成物
US20170029674A1 (en) * 2015-07-30 2017-02-02 Boe Technology Group Co., Ltd. Sealant composition and method for curing the same, display device and sealing method, and use thereof
WO2020067827A1 (fr) * 2018-09-28 2020-04-02 주식회사 엘지화학 Composition de matériau d'étanchéité

Also Published As

Publication number Publication date
WO2021131790A1 (fr) 2021-07-01
KR20220111301A (ko) 2022-08-09
CN114902804A (zh) 2022-08-12
TW202126760A (zh) 2021-07-16

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