JPWO2021131171A1 - - Google Patents

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Publication number
JPWO2021131171A1
JPWO2021131171A1 JP2021566816A JP2021566816A JPWO2021131171A1 JP WO2021131171 A1 JPWO2021131171 A1 JP WO2021131171A1 JP 2021566816 A JP2021566816 A JP 2021566816A JP 2021566816 A JP2021566816 A JP 2021566816A JP WO2021131171 A1 JPWO2021131171 A1 JP WO2021131171A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021566816A
Other versions
JP7534654B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021131171A1 publication Critical patent/JPWO2021131171A1/ja
Priority to JP2024114842A priority Critical patent/JP2024147733A/ja
Application granted granted Critical
Publication of JP7534654B2 publication Critical patent/JP7534654B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/0234—Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02335—Up-side up mountings, e.g. epi-side up mountings or junction up mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Head (AREA)
JP2021566816A 2019-12-26 2020-09-08 レーザ光源 Active JP7534654B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024114842A JP2024147733A (ja) 2019-12-26 2024-07-18 レーザ光源

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019236440 2019-12-26
JP2019236440 2019-12-26
JP2020114674 2020-07-02
JP2020114674 2020-07-02
PCT/JP2020/033897 WO2021131171A1 (ja) 2019-12-26 2020-09-08 レーザ光源

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024114842A Division JP2024147733A (ja) 2019-12-26 2024-07-18 レーザ光源

Publications (2)

Publication Number Publication Date
JPWO2021131171A1 true JPWO2021131171A1 (ja) 2021-07-01
JP7534654B2 JP7534654B2 (ja) 2024-08-15

Family

ID=76575868

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021566816A Active JP7534654B2 (ja) 2019-12-26 2020-09-08 レーザ光源
JP2024114842A Pending JP2024147733A (ja) 2019-12-26 2024-07-18 レーザ光源

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024114842A Pending JP2024147733A (ja) 2019-12-26 2024-07-18 レーザ光源

Country Status (5)

Country Link
US (1) US20230031544A1 (ja)
EP (1) EP4084239A4 (ja)
JP (2) JP7534654B2 (ja)
CN (1) CN114938693A (ja)
WO (1) WO2021131171A1 (ja)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5794968A (en) * 1980-12-01 1982-06-12 Victor Co Of Japan Ltd Adapter for tape cassette
JP3154181B2 (ja) * 1991-02-19 2001-04-09 ソニー株式会社 半導体レーザ装置
JPH05267794A (ja) * 1992-03-19 1993-10-15 Ando Electric Co Ltd 半導体レーザモジュールのチップキャリア固定構造
JP3400574B2 (ja) * 1994-11-30 2003-04-28 株式会社リコー 樹脂製レンズ
JP3165779B2 (ja) * 1995-07-18 2001-05-14 株式会社トクヤマ サブマウント
JP2000098190A (ja) 1998-09-25 2000-04-07 Mitsui Chemicals Inc 半導体レーザユニット、半導体レーザモジュールおよび 半導体レーザ励起固体レーザ装置
JP2002368320A (ja) * 2001-06-05 2002-12-20 Matsushita Electric Ind Co Ltd 半導体レーザアレイユニット、並びに半導体レーザアレイユニットのアライメント調整方法及び装置
US6975659B2 (en) * 2001-09-10 2005-12-13 Fuji Photo Film Co., Ltd. Laser diode array, laser device, wave-coupling laser source, and exposure device
JP4368563B2 (ja) * 2002-07-10 2009-11-18 富士フイルム株式会社 レーザー装置
JP2004096088A (ja) * 2002-07-10 2004-03-25 Fuji Photo Film Co Ltd 合波レーザー光源および露光装置
JP2005243659A (ja) * 2003-12-26 2005-09-08 Toshiba Corp 半導体レーザ装置
JP2010073758A (ja) * 2008-09-16 2010-04-02 Furukawa Electric Co Ltd:The 半導体レーザモジュール
JP2014006476A (ja) * 2012-06-27 2014-01-16 Ricoh Co Ltd 光源装置
DE102013006316B4 (de) * 2013-04-12 2017-01-26 Jenoptik Laser Gmbh Optikbaugruppe und Lasermodul mit Optikbaugruppe
JP6683482B2 (ja) 2015-01-22 2020-04-22 三菱エンジニアリングプラスチックス株式会社 レーザー溶着用部材及び成形品
US11431146B2 (en) * 2015-03-27 2022-08-30 Jabil Inc. Chip on submount module
US11437774B2 (en) * 2015-08-19 2022-09-06 Kyocera Sld Laser, Inc. High-luminous flux laser-based white light source
WO2019009086A1 (ja) 2017-07-07 2019-01-10 パナソニックＩｐマネジメント株式会社 半導体レーザ装置
JP2019062033A (ja) * 2017-09-26 2019-04-18 パナソニック株式会社 半導体レーザ装置
JP2019096637A (ja) * 2017-11-17 2019-06-20 株式会社小糸製作所 レーザー光源ユニット

Also Published As

Publication number Publication date
JP7534654B2 (ja) 2024-08-15
US20230031544A1 (en) 2023-02-02
EP4084239A1 (en) 2022-11-02
JP2024147733A (ja) 2024-10-16
WO2021131171A1 (ja) 2021-07-01
CN114938693A (zh) 2022-08-23
EP4084239A4 (en) 2024-01-10

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