JPWO2021130891A1 - - Google Patents
Info
- Publication number
- JPWO2021130891A1 JPWO2021130891A1 JP2021566630A JP2021566630A JPWO2021130891A1 JP WO2021130891 A1 JPWO2021130891 A1 JP WO2021130891A1 JP 2021566630 A JP2021566630 A JP 2021566630A JP 2021566630 A JP2021566630 A JP 2021566630A JP WO2021130891 A1 JPWO2021130891 A1 JP WO2021130891A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023183209A JP2024008958A (en) | 2019-12-25 | 2023-10-25 | Substrate transport device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/050796 WO2021130891A1 (en) | 2019-12-25 | 2019-12-25 | Substrate conveyance device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023183209A Division JP2024008958A (en) | 2019-12-25 | 2023-10-25 | Substrate transport device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021130891A1 true JPWO2021130891A1 (en) | 2021-07-01 |
Family
ID=76573140
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021566630A Pending JPWO2021130891A1 (en) | 2019-12-25 | 2019-12-25 | |
| JP2023183209A Pending JP2024008958A (en) | 2019-12-25 | 2023-10-25 | Substrate transport device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023183209A Pending JP2024008958A (en) | 2019-12-25 | 2023-10-25 | Substrate transport device |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JPWO2021130891A1 (en) |
| CN (1) | CN114846910A (en) |
| WO (1) | WO2021130891A1 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060105612A1 (en) * | 2004-11-12 | 2006-05-18 | Airline Hydraulics Corp. | Printed circuit board clamp |
| JP2015035457A (en) * | 2013-08-08 | 2015-02-19 | Juki株式会社 | Substrate conveyor device |
| WO2018235155A1 (en) * | 2017-06-20 | 2018-12-27 | 株式会社Ｆｕｊｉ | Electronic component mounting machine |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4950831B2 (en) * | 2007-10-15 | 2012-06-13 | 富士機械製造株式会社 | Substrate transfer conveyor |
| JP6535094B2 (en) * | 2015-08-05 | 2019-06-26 | 株式会社Ｆｕｊｉ | Solder printing machine |
| JP7244208B2 (en) * | 2017-06-16 | 2023-03-22 | 日本メクトロン株式会社 | Squeegee, squeegee plate holder, screen printer |
-
2019
- 2019-12-25 CN CN201980103192.XA patent/CN114846910A/en active Pending
- 2019-12-25 WO PCT/JP2019/050796 patent/WO2021130891A1/en active Application Filing
- 2019-12-25 JP JP2021566630A patent/JPWO2021130891A1/ja active Pending
-
2023
- 2023-10-25 JP JP2023183209A patent/JP2024008958A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060105612A1 (en) * | 2004-11-12 | 2006-05-18 | Airline Hydraulics Corp. | Printed circuit board clamp |
| JP2015035457A (en) * | 2013-08-08 | 2015-02-19 | Juki株式会社 | Substrate conveyor device |
| WO2018235155A1 (en) * | 2017-06-20 | 2018-12-27 | 株式会社Ｆｕｊｉ | Electronic component mounting machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2024008958A (en) | 2024-01-19 |
| WO2021130891A1 (en) | 2021-07-01 |
| CN114846910A (en) | 2022-08-02 |
Similar Documents
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