JPWO2021125102A1 - - Google Patents

Info

Publication number
JPWO2021125102A1
JPWO2021125102A1 JP2021565557A JP2021565557A JPWO2021125102A1 JP WO2021125102 A1 JPWO2021125102 A1 JP WO2021125102A1 JP 2021565557 A JP2021565557 A JP 2021565557A JP 2021565557 A JP2021565557 A JP 2021565557A JP WO2021125102 A1 JPWO2021125102 A1 JP WO2021125102A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021565557A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021125102A1 publication Critical patent/JPWO2021125102A1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/0882Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such
JP2021565557A 2019-12-20 2020-12-11 Pending JPWO2021125102A1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019230944 2019-12-20
JP2019230945 2019-12-20
PCT/JP2020/046381 WO2021125102A1 (ja) 2019-12-20 2020-12-11 実装システム及び実装方法

Publications (1)

Publication Number Publication Date
JPWO2021125102A1 true JPWO2021125102A1 (de) 2021-06-24

Family

ID=76477483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021565557A Pending JPWO2021125102A1 (de) 2019-12-20 2020-12-11

Country Status (4)

Country Link
JP (1) JPWO2021125102A1 (de)
CN (1) CN114731780A (de)
DE (1) DE112020006256T5 (de)
WO (1) WO2021125102A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117813930A (zh) * 2022-02-25 2024-04-02 松下知识产权经营株式会社 安装系统以及安装方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10145096A (ja) * 1996-11-07 1998-05-29 Fuji Xerox Co Ltd 電子部品の装着方法及び装置
JP2001168594A (ja) * 1999-12-06 2001-06-22 Hitachi Ltd 表面実装部品搭載装置
JP2004071641A (ja) 2002-08-01 2004-03-04 Matsushita Electric Ind Co Ltd 部品実装方法及び部品実装装置
JP4543935B2 (ja) * 2005-01-17 2010-09-15 パナソニック株式会社 電子部品実装装置及び実装方法
JP6462000B2 (ja) * 2014-12-10 2019-01-30 株式会社Fuji 部品実装機

Also Published As

Publication number Publication date
DE112020006256T5 (de) 2022-09-29
CN114731780A (zh) 2022-07-08
WO2021125102A1 (ja) 2021-06-24

Similar Documents

Publication Publication Date Title
BR112019017762A2 (de)
BR112021017339A2 (de)
BR112021013854A2 (de)
BR112021017939A2 (de)
BR112021017892A2 (de)
BR112019016141A2 (de)
BR112021017738A2 (de)
BR112021017782A2 (de)
BR112019016142A2 (de)
BR112021018168A2 (de)
BR112021017728A2 (de)
BR112021017234A2 (de)
BR112021017355A2 (de)
BR112021017173A2 (de)
BR112021018102A2 (de)
BR112021017083A2 (de)
BR112021017637A2 (de)
BR112021012348A2 (de)
BR112021018093A2 (de)
BR112021018084A2 (de)
BR112021013128A2 (de)
BR112021017732A2 (de)
JPWO2021125102A1 (de)
BR112021015080A2 (de)
BR112021017949A2 (de)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231010