JPWO2021107107A1 - - Google Patents

Info

Publication number
JPWO2021107107A1
JPWO2021107107A1 JP2021561553A JP2021561553A JPWO2021107107A1 JP WO2021107107 A1 JPWO2021107107 A1 JP WO2021107107A1 JP 2021561553 A JP2021561553 A JP 2021561553A JP 2021561553 A JP2021561553 A JP 2021561553A JP WO2021107107 A1 JPWO2021107107 A1 JP WO2021107107A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021561553A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021107107A1 publication Critical patent/JPWO2021107107A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables

Landscapes

  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
JP2021561553A 2019-11-30 2020-11-27 Pending JPWO2021107107A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019217642 2019-11-30
PCT/JP2020/044252 WO2021107107A1 (en) 2019-11-30 2020-11-27 Nickel nanoparticle composition and laminate

Publications (1)

Publication Number Publication Date
JPWO2021107107A1 true JPWO2021107107A1 (en) 2021-06-03

Family

ID=76129549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021561553A Pending JPWO2021107107A1 (en) 2019-11-30 2020-11-27

Country Status (3)

Country Link
JP (1) JPWO2021107107A1 (en)
TW (1) TW202122506A (en)
WO (1) WO2021107107A1 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101719850B1 (en) * 2009-09-30 2017-03-24 다이니폰 인사츠 가부시키가이샤 Metal microparticle dispersion, process for production of electrically conductive substrate, and electrically conductive substrate
US8765025B2 (en) * 2010-06-09 2014-07-01 Xerox Corporation Silver nanoparticle composition comprising solvents with specific hansen solubility parameters
US20120286502A1 (en) * 2011-05-13 2012-11-15 Xerox Corporation Storage Stable Images
JP2013067865A (en) * 2012-11-12 2013-04-18 Sumitomo Electric Ind Ltd Metal powder, electroconductive paste and multilayer ceramic capacitor
JP6037893B2 (en) * 2013-02-26 2016-12-07 新日鉄住金化学株式会社 Metal fine particle composition, bonding material, electronic component, method for forming bonding layer, method for forming conductor layer, and ink composition
US10563079B2 (en) * 2016-03-04 2020-02-18 Xerox Corporation Silver nanoparticle ink
JP7164313B2 (en) * 2017-03-31 2022-11-01 日鉄ケミカル＆マテリアル株式会社 Nickel fine particle composition, bonded structure and bonding method
US11267981B2 (en) * 2018-04-03 2022-03-08 Massachusetts Institute Of Technology 3-D printed devices formed with conductive inks and method of making

Also Published As

Publication number Publication date
TW202122506A (en) 2021-06-16
WO2021107107A1 (en) 2021-06-03

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