JPWO2021106920A1 - - Google Patents

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Publication number
JPWO2021106920A1
JPWO2021106920A1 JP2021561446A JP2021561446A JPWO2021106920A1 JP WO2021106920 A1 JPWO2021106920 A1 JP WO2021106920A1 JP 2021561446 A JP2021561446 A JP 2021561446A JP 2021561446 A JP2021561446 A JP 2021561446A JP WO2021106920 A1 JPWO2021106920 A1 JP WO2021106920A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021561446A
Other versions
JPWO2021106920A5 (ja
JP7053973B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2021106920A1 publication Critical patent/JPWO2021106920A1/ja
Publication of JPWO2021106920A5 publication Critical patent/JPWO2021106920A5/ja
Application granted granted Critical
Publication of JP7053973B2 publication Critical patent/JP7053973B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/16Regeneration of process solutions
    • C25D21/18Regeneration of process solutions of electrolytes
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20Electroplating using ultrasonics, vibrations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Physical Water Treatments (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Apparatus For Disinfection Or Sterilisation (AREA)
  • Silver Salt Photography Or Processing Solution Therefor (AREA)
JP2021561446A 2019-11-27 2020-11-25 湿式めっき工程におけるバイオフィルムの抑制方法 Active JP7053973B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019213877 2019-11-27
JP2019213877 2019-11-27
PCT/JP2020/043777 WO2021106920A1 (ja) 2019-11-27 2020-11-25 湿式めっき工程におけるバイオフィルムの抑制方法

Publications (3)

Publication Number Publication Date
JPWO2021106920A1 true JPWO2021106920A1 (ja) 2021-06-03
JPWO2021106920A5 JPWO2021106920A5 (ja) 2022-03-25
JP7053973B2 JP7053973B2 (ja) 2022-04-12

Family

ID=76129347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021561446A Active JP7053973B2 (ja) 2019-11-27 2020-11-25 湿式めっき工程におけるバイオフィルムの抑制方法

Country Status (4)

Country Link
JP (1) JP7053973B2 (ja)
MY (1) MY195172A (ja)
TW (1) TWI772983B (ja)
WO (1) WO2021106920A1 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011052309A (ja) * 2009-09-04 2011-03-17 Ebara-Udylite Co Ltd めっき関連槽中での微生物増殖抑制方法およびこれに用いる微生物の増殖抑制システム
JP2016501099A (ja) * 2012-12-17 2016-01-18 アメリカン イーグル インストラメンツ インコーポレイテッドAmerican Eagle Instruments, Inc. 放電洗浄器装置及び方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2441817Y (zh) * 2000-08-31 2001-08-08 湖南省郴州市山河电子设备有限公司 超声波电镀装置
CN208843903U (zh) * 2018-08-07 2019-05-10 浙江海拓环境技术有限公司 一种用于电镀废水深度处理的防结垢生物滤池系统

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011052309A (ja) * 2009-09-04 2011-03-17 Ebara-Udylite Co Ltd めっき関連槽中での微生物増殖抑制方法およびこれに用いる微生物の増殖抑制システム
JP2016501099A (ja) * 2012-12-17 2016-01-18 アメリカン イーグル インストラメンツ インコーポレイテッドAmerican Eagle Instruments, Inc. 放電洗浄器装置及び方法

Also Published As

Publication number Publication date
TWI772983B (zh) 2022-08-01
WO2021106920A1 (ja) 2021-06-03
JP7053973B2 (ja) 2022-04-12
TW202129087A (zh) 2021-08-01
MY195172A (en) 2023-01-11

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