JPWO2021095634A1 - - Google Patents
Info
- Publication number
- JPWO2021095634A1 JPWO2021095634A1 JP2021556056A JP2021556056A JPWO2021095634A1 JP WO2021095634 A1 JPWO2021095634 A1 JP WO2021095634A1 JP 2021556056 A JP2021556056 A JP 2021556056A JP 2021556056 A JP2021556056 A JP 2021556056A JP WO2021095634 A1 JPWO2021095634 A1 JP WO2021095634A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019204806 | 2019-11-12 | ||
PCT/JP2020/041348 WO2021095634A1 (en) | 2019-11-12 | 2020-11-05 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021095634A1 true JPWO2021095634A1 (en) | 2021-05-20 |
Family
ID=75912902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021556056A Pending JPWO2021095634A1 (en) | 2019-11-12 | 2020-11-05 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2021095634A1 (en) |
WO (1) | WO2021095634A1 (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005078399A1 (en) * | 2004-02-16 | 2005-08-25 | Matsushita Electric Industrial Co., Ltd. | Infrared imaging element |
KR100825760B1 (en) * | 2006-06-02 | 2008-04-29 | 한국전자통신연구원 | Abrupt metal-insulator transitionMIT device, MIT sensor using the same abrupt MIT device, and alarming apparatus and secondary battery anti-explosion circuit comprising the same MIT sensor |
JP2011216768A (en) * | 2010-04-01 | 2011-10-27 | Elpida Memory Inc | Semiconductor device, and method of manufacturing the same |
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2020
- 2020-11-05 JP JP2021556056A patent/JPWO2021095634A1/ja active Pending
- 2020-11-05 WO PCT/JP2020/041348 patent/WO2021095634A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2021095634A1 (en) | 2021-05-20 |
Similar Documents
Legal Events
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