JPWO2021095295A1 - - Google Patents

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Publication number
JPWO2021095295A1
JPWO2021095295A1 JP2021555903A JP2021555903A JPWO2021095295A1 JP WO2021095295 A1 JPWO2021095295 A1 JP WO2021095295A1 JP 2021555903 A JP2021555903 A JP 2021555903A JP 2021555903 A JP2021555903 A JP 2021555903A JP WO2021095295 A1 JPWO2021095295 A1 JP WO2021095295A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021555903A
Other languages
Japanese (ja)
Other versions
JPWO2021095295A5 (zh
JP7108347B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of JPWO2021095295A1 publication Critical patent/JPWO2021095295A1/ja
Publication of JPWO2021095295A5 publication Critical patent/JPWO2021095295A5/ja
Application granted granted Critical
Publication of JP7108347B2 publication Critical patent/JP7108347B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
JP2021555903A 2019-11-11 2020-06-24 成膜装置 Active JP7108347B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201911094854.X 2019-11-11
CN201911094854.XA CN112779507B (zh) 2019-11-11 2019-11-11 成膜装置
PCT/JP2020/024826 WO2021095295A1 (ja) 2019-11-11 2020-06-24 成膜装置

Publications (3)

Publication Number Publication Date
JPWO2021095295A1 true JPWO2021095295A1 (zh) 2021-05-20
JPWO2021095295A5 JPWO2021095295A5 (zh) 2022-03-08
JP7108347B2 JP7108347B2 (ja) 2022-07-28

Family

ID=75749726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021555903A Active JP7108347B2 (ja) 2019-11-11 2020-06-24 成膜装置

Country Status (3)

Country Link
JP (1) JP7108347B2 (zh)
CN (1) CN112779507B (zh)
WO (1) WO2021095295A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115386853A (zh) * 2022-08-16 2022-11-25 深圳市瑞泓塑胶五金镀膜技术有限公司 一种用于五金加工的镀膜速率可调节镀膜装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012053171A1 (ja) * 2010-10-20 2012-04-26 株式会社アルバック 真空処理装置
JP2014222693A (ja) * 2013-05-13 2014-11-27 大陽日酸株式会社 気相成長装置および気相成長装置の部材搬送方法
JP2018090867A (ja) * 2016-12-06 2018-06-14 東京エレクトロン株式会社 基板上に膜を形成する方法、及び、成膜システム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06136517A (ja) * 1992-10-26 1994-05-17 Sony Corp 薄膜形成方法及びその装置
JP6533511B2 (ja) * 2015-06-17 2019-06-19 株式会社シンクロン 成膜方法及び成膜装置
CN108690963B (zh) * 2017-04-10 2020-06-23 株式会社新柯隆 成膜装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012053171A1 (ja) * 2010-10-20 2012-04-26 株式会社アルバック 真空処理装置
JP2014222693A (ja) * 2013-05-13 2014-11-27 大陽日酸株式会社 気相成長装置および気相成長装置の部材搬送方法
JP2018090867A (ja) * 2016-12-06 2018-06-14 東京エレクトロン株式会社 基板上に膜を形成する方法、及び、成膜システム

Also Published As

Publication number Publication date
JP7108347B2 (ja) 2022-07-28
WO2021095295A1 (ja) 2021-05-20
CN112779507A (zh) 2021-05-11
CN112779507B (zh) 2024-02-09

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