JPWO2021070599A1 - - Google Patents

Info

Publication number
JPWO2021070599A1
JPWO2021070599A1 JP2021550628A JP2021550628A JPWO2021070599A1 JP WO2021070599 A1 JPWO2021070599 A1 JP WO2021070599A1 JP 2021550628 A JP2021550628 A JP 2021550628A JP 2021550628 A JP2021550628 A JP 2021550628A JP WO2021070599 A1 JPWO2021070599 A1 JP WO2021070599A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021550628A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021070599A1 publication Critical patent/JPWO2021070599A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B25J13/087—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices for sensing other physical parameters, e.g. electrical or chemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D19/00—Pallets or like platforms, with or without side walls, for supporting loads to be lifted or lowered
    • B65D19/38—Details or accessories
    • B65D19/44—Elements or devices for locating articles on platforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Human Computer Interaction (AREA)
  • Manipulator (AREA)
  • Packaging Frangible Articles (AREA)
JP2021550628A 2019-10-11 2020-09-18 Pending JPWO2021070599A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019187731 2019-10-11
PCT/JP2020/035532 WO2021070599A1 (en) 2019-10-11 2020-09-18 Method and device for manufacturing glass plate package

Publications (1)

Publication Number Publication Date
JPWO2021070599A1 true JPWO2021070599A1 (en) 2021-04-15

Family

ID=75437893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021550628A Pending JPWO2021070599A1 (en) 2019-10-11 2020-09-18

Country Status (5)

Country Link
JP (1) JPWO2021070599A1 (en)
KR (1) KR20220079812A (en)
CN (1) CN114286788A (en)
TW (1) TWI846958B (en)
WO (1) WO2021070599A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3206887B2 (en) * 1996-12-20 2001-09-10 セントラル硝子株式会社 Method and apparatus for correcting pallet loading position
JP4480633B2 (en) * 2005-06-21 2010-06-16 セントラル硝子株式会社 Method and apparatus for loading glass plate onto pallet
JP2009295682A (en) * 2008-06-03 2009-12-17 Mitsubishi Materials Techno Corp Handling apparatus of glass plate
JP5311277B2 (en) * 2008-07-29 2013-10-09 日本電気硝子株式会社 Plate workpiece transfer equipment and transfer method
JP5196158B2 (en) * 2008-10-07 2013-05-15 日本電気硝子株式会社 Glass substrate packing apparatus and packing method thereof

Also Published As

Publication number Publication date
TW202115819A (en) 2021-04-16
CN114286788A (en) 2022-04-05
KR20220079812A (en) 2022-06-14
TWI846958B (en) 2024-07-01
WO2021070599A1 (en) 2021-04-15

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Legal Events

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Effective date: 20230404

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