JPWO2021060189A1 - - Google Patents

Info

Publication number
JPWO2021060189A1
JPWO2021060189A1 JP2021548882A JP2021548882A JPWO2021060189A1 JP WO2021060189 A1 JPWO2021060189 A1 JP WO2021060189A1 JP 2021548882 A JP2021548882 A JP 2021548882A JP 2021548882 A JP2021548882 A JP 2021548882A JP WO2021060189 A1 JPWO2021060189 A1 JP WO2021060189A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021548882A
Other languages
Japanese (ja)
Other versions
JP7184205B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021060189A1 publication Critical patent/JPWO2021060189A1/ja
Application granted granted Critical
Publication of JP7184205B2 publication Critical patent/JP7184205B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
JP2021548882A 2019-09-26 2020-09-18 Connector measurement probe and connector measurement method Active JP7184205B2 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019175278 2019-09-26
JP2019175278 2019-09-26
JP2020122447 2020-07-16
JP2020122447 2020-07-16
PCT/JP2020/035482 WO2021060189A1 (en) 2019-09-26 2020-09-18 Probe for measuring connector and method of measuring connector

Publications (2)

Publication Number Publication Date
JPWO2021060189A1 true JPWO2021060189A1 (en) 2021-04-01
JP7184205B2 JP7184205B2 (en) 2022-12-06

Family

ID=75165776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021548882A Active JP7184205B2 (en) 2019-09-26 2020-09-18 Connector measurement probe and connector measurement method

Country Status (3)

Country Link
JP (1) JP7184205B2 (en)
TW (1) TWI761964B (en)
WO (1) WO2021060189A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7464009B2 (en) 2021-06-10 2024-04-09 株式会社村田製作所 Connector set and coaxial connector

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003123910A (en) * 2001-10-12 2003-04-25 Murata Mfg Co Ltd Contact probe and measuring device of communication device using this contact probe
JP2005149854A (en) * 2003-11-13 2005-06-09 Nec Electronics Corp Probe, ic socket, and semiconductor circuit
US20090224785A1 (en) * 2008-03-07 2009-09-10 Formfactor, Inc. Providing an electrically conductive wall structure adjacent a contact structure of an electronic device
US20100255690A1 (en) * 2009-04-02 2010-10-07 Qualcomm Incorporated Spacer-connector and circuit board assembly
JP2020020663A (en) * 2018-07-31 2020-02-06 東京特殊電線株式会社 Semiconductor device inspection jig

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM408843U (en) * 2011-03-08 2011-08-01 Cen Link Co Ltd Electrical connector
TWI642941B (en) * 2017-05-08 2018-12-01 旺矽科技股份有限公司 Probe card

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003123910A (en) * 2001-10-12 2003-04-25 Murata Mfg Co Ltd Contact probe and measuring device of communication device using this contact probe
JP2005149854A (en) * 2003-11-13 2005-06-09 Nec Electronics Corp Probe, ic socket, and semiconductor circuit
US20090224785A1 (en) * 2008-03-07 2009-09-10 Formfactor, Inc. Providing an electrically conductive wall structure adjacent a contact structure of an electronic device
US20100255690A1 (en) * 2009-04-02 2010-10-07 Qualcomm Incorporated Spacer-connector and circuit board assembly
JP2020020663A (en) * 2018-07-31 2020-02-06 東京特殊電線株式会社 Semiconductor device inspection jig

Also Published As

Publication number Publication date
CN113939744A (en) 2022-01-14
TWI761964B (en) 2022-04-21
WO2021060189A1 (en) 2021-04-01
TW202127041A (en) 2021-07-16
JP7184205B2 (en) 2022-12-06

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