JPWO2021059647A1 - - Google Patents

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Publication number
JPWO2021059647A1
JPWO2021059647A1 JP2021548352A JP2021548352A JPWO2021059647A1 JP WO2021059647 A1 JPWO2021059647 A1 JP WO2021059647A1 JP 2021548352 A JP2021548352 A JP 2021548352A JP 2021548352 A JP2021548352 A JP 2021548352A JP WO2021059647 A1 JPWO2021059647 A1 JP WO2021059647A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021548352A
Other languages
Japanese (ja)
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JP7152616B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPWO2021059647A1 publication Critical patent/JPWO2021059647A1/ja
Application granted granted Critical
Publication of JP7152616B2 publication Critical patent/JP7152616B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
JP2021548352A 2019-09-25 2020-06-30 Heat dissipation sheet Active JP7152616B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019173833 2019-09-25
JP2019173833 2019-09-25
PCT/JP2020/025718 WO2021059647A1 (en) 2019-09-25 2020-06-30 Heat dissipation sheet

Publications (2)

Publication Number Publication Date
JPWO2021059647A1 true JPWO2021059647A1 (en) 2021-04-01
JP7152616B2 JP7152616B2 (en) 2022-10-12

Family

ID=75165992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021548352A Active JP7152616B2 (en) 2019-09-25 2020-06-30 Heat dissipation sheet

Country Status (3)

Country Link
JP (1) JP7152616B2 (en)
CN (1) CN114402706B (en)
WO (1) WO2021059647A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012133587A1 (en) * 2011-03-28 2012-10-04 日立化成工業株式会社 Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for manufacturing same, semiconductor device, and led device
JP2019006837A (en) * 2015-10-29 2019-01-17 日東電工株式会社 Heat-conductive sheet and semiconductor module
WO2019065150A1 (en) * 2017-09-28 2019-04-04 富士フイルム株式会社 Heat-radiating sheet and device having heat-radiating sheet
JP2019116401A (en) * 2017-12-27 2019-07-18 昭和電工株式会社 Hexagonal crystal boron nitride powder and method for producing the same, and composition and heat dissipation member using the same
JP2019137608A (en) * 2014-02-05 2019-08-22 三菱ケミカル株式会社 Boron nitride aggregated particle, manufacturing method of boron nitride aggregated particle, boron nitride aggregated particle-containing resin composition, molded body, and sheet

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6453057B2 (en) * 2014-11-20 2019-01-16 三井・ケマーズ フロロプロダクツ株式会社 Heat-meltable fluororesin composition excellent in thermal conductivity, molded article produced from the composition, and method for producing the same
WO2018139643A1 (en) * 2017-01-30 2018-08-02 積水化学工業株式会社 Resin material and laminate
KR20190111019A (en) * 2017-01-30 2019-10-01 세키스이가가쿠 고교가부시키가이샤 Resin Materials and Laminates

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012133587A1 (en) * 2011-03-28 2012-10-04 日立化成工業株式会社 Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for manufacturing same, semiconductor device, and led device
JP2019137608A (en) * 2014-02-05 2019-08-22 三菱ケミカル株式会社 Boron nitride aggregated particle, manufacturing method of boron nitride aggregated particle, boron nitride aggregated particle-containing resin composition, molded body, and sheet
JP2019006837A (en) * 2015-10-29 2019-01-17 日東電工株式会社 Heat-conductive sheet and semiconductor module
WO2019065150A1 (en) * 2017-09-28 2019-04-04 富士フイルム株式会社 Heat-radiating sheet and device having heat-radiating sheet
JP2019116401A (en) * 2017-12-27 2019-07-18 昭和電工株式会社 Hexagonal crystal boron nitride powder and method for producing the same, and composition and heat dissipation member using the same

Also Published As

Publication number Publication date
WO2021059647A1 (en) 2021-04-01
CN114402706B (en) 2024-04-30
CN114402706A (en) 2022-04-26
JP7152616B2 (en) 2022-10-12

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