JPWO2021054195A1 - - Google Patents
Info
- Publication number
- JPWO2021054195A1 JPWO2021054195A1 JP2020556978A JP2020556978A JPWO2021054195A1 JP WO2021054195 A1 JPWO2021054195 A1 JP WO2021054195A1 JP 2020556978 A JP2020556978 A JP 2020556978A JP 2020556978 A JP2020556978 A JP 2020556978A JP WO2021054195 A1 JPWO2021054195 A1 JP WO2021054195A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J1/00—Adhesives based on inorganic constituents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019169968 | 2019-09-19 | ||
PCT/JP2020/033933 WO2021054195A1 (en) | 2019-09-19 | 2020-09-08 | Adhesive for air cavity formation and antenna device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021054195A1 true JPWO2021054195A1 (en) | 2021-03-25 |
Family
ID=74883132
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020556978A Pending JPWO2021054195A1 (en) | 2019-09-19 | 2020-09-08 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2021054195A1 (en) |
TW (1) | TW202130757A (en) |
WO (1) | WO2021054195A1 (en) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100574215B1 (en) * | 1997-04-17 | 2006-04-27 | 세키스이가가쿠 고교가부시키가이샤 | Conductive particles |
JP5371997B2 (en) * | 2008-09-05 | 2013-12-18 | 三菱電機株式会社 | High frequency circuit package and sensor module |
-
2020
- 2020-09-08 JP JP2020556978A patent/JPWO2021054195A1/ja active Pending
- 2020-09-08 WO PCT/JP2020/033933 patent/WO2021054195A1/en active Application Filing
- 2020-09-18 TW TW109132338A patent/TW202130757A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW202130757A (en) | 2021-08-16 |
WO2021054195A1 (en) | 2021-03-25 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230605 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240402 |