JPWO2021015007A1 - - Google Patents
Info
- Publication number
- JPWO2021015007A1 JPWO2021015007A1 JP2021533944A JP2021533944A JPWO2021015007A1 JP WO2021015007 A1 JPWO2021015007 A1 JP WO2021015007A1 JP 2021533944 A JP2021533944 A JP 2021533944A JP 2021533944 A JP2021533944 A JP 2021533944A JP WO2021015007 A1 JPWO2021015007 A1 JP WO2021015007A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/38—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling sheets of limited length, e.g. folded sheets, superimposed sheets, pack rolling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019135112 | 2019-07-23 | ||
| PCT/JP2020/027034 WO2021015007A1 (en) | 2019-07-23 | 2020-07-10 | Heat dissipation plate and method for manufacturing heat dissipation plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021015007A1 true JPWO2021015007A1 (en) | 2021-01-28 |
Family
ID=74193928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021533944A Pending JPWO2021015007A1 (en) | 2019-07-23 | 2020-07-10 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2021015007A1 (en) |
| CN (1) | CN113632221A (en) |
| WO (1) | WO2021015007A1 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3526614B2 (en) * | 1993-11-30 | 2004-05-17 | 新日本製鐵株式会社 | Semiconductor device |
| JPH1092989A (en) * | 1996-09-10 | 1998-04-10 | Furukawa Electric Co Ltd:The | Heat sink material and production thereof |
| JPH10233474A (en) * | 1997-02-19 | 1998-09-02 | Hitachi Metals Ltd | Heat spreader, semiconductor device using the spreader and manufacture of heat spreader |
-
2020
- 2020-07-10 WO PCT/JP2020/027034 patent/WO2021015007A1/en active Application Filing
- 2020-07-10 CN CN202080023498.7A patent/CN113632221A/en active Pending
- 2020-07-10 JP JP2021533944A patent/JPWO2021015007A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021015007A1 (en) | 2021-01-28 |
| CN113632221A (en) | 2021-11-09 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230512 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240319 |