JPWO2020260251A5

JPWO2020260251A5 -

Info

Publication number: JPWO2020260251A5
Application number: JP2021576724A
Authority: JP
Publication date: 2022-11-18

Description

本発明の一実施形態によると、誘電体材料６１６は、プリント回路板、有機ラミネート、シリコン・ウエハ、セラミック、ＦＲ－４などのガラス強化エポキシ・ラミネート材料、デュロイド、テフロン（Ｒ）、またはポリエーテル・エーテル・ケトン（ＰＥＥＫ）のうちの１つもしくは複数を含む。本発明の一実施形態によると、マイクロ波－光周波数変換器は、光周波数領域で動作するように構成されたデバイスに結合されたマイクロ波導波路を含む。変換チップ６１２は、図２の光ポンプ線路２０８などの、光周波数領域で動作するように構成されたデバイスに結合された光ポンプ線路をさらに含むことができる。光ポンプ線路は、量子情報を、封じ込め容器６０２によって画定された冷却真空環境から封じ込め容器６０２の外部に光周波数信号として伝送するように構成されてもよい。代替的または追加的に、光ポンプ線路は、量子情報を光周波数信号として、変換チップ６１２から、第２の量子ビット・チップに結合された第２の変換チップに伝送するように構成されてもよい。
According to one embodiment of the present invention, dielectric material 616 is a printed circuit board, organic laminate, silicon wafer , ceramic, glass reinforced epoxy laminate material such as FR-4, duroid, Teflon, or polyether. - containing one or more of ether ketones (PEEK); According to one embodiment of the invention, a microwave-to-optical frequency converter includes a microwave waveguide coupled to a device configured to operate in the optical frequency domain. Conversion chip 612 may further include an optical pumpline coupled to a device configured to operate in the optical frequency domain, such as optical pumpline 208 in FIG. The optical pumpline may be configured to transmit quantum information from the cooled vacuum environment defined by containment vessel 602 to the exterior of containment vessel 602 as optical frequency signals. Alternatively or additionally, the optical pumpline may be configured to transmit quantum information as an optical frequency signal from conversion chip 612 to a second conversion chip coupled to the second qubit chip. good.

Claims

A system for optical conversion of quantum information, comprising:
a qubit chip including a plurality of data qubits configured to operate at microwave frequencies;
a conversion chip spaced from the qubit chip, the conversion chip comprising a microwave-to-optical frequency converter;
an interposer coupled to the qubit chip and the conversion chip, the interposer comprising a dielectric material having a plurality of superconducting microwave waveguides formed therein;
wherein said plurality of superconducting microwave waveguides are configured to transmit quantum information from said plurality of data qubits to said microwave-to-optical frequency converter on said conversion chip; A system, wherein a converter is configured to convert said quantum information from said microwave frequency to optical frequency.

The microwave-to-optical frequency converter is further configured to convert quantum information from the optical frequency to the microwave frequency, and the plurality of superconducting microwave waveguides converts the quantum information to the microwave frequency on the conversion chip. 2. The system of claim 1, configured to transmit from a microwave-to-optical frequency converter to the plurality of data qubits.

3. The system of claim 1 or 2, wherein the microwave-to-optical frequency converter comprises a microwave waveguide coupled to a device configured to operate in the optical frequency domain.

4. The system of Claim 3, wherein the device configured to operate in the optical frequency domain comprises an optical resonator.

5. The system of claim 4, wherein the conversion chip further comprises an optical pump line coupled to the optical resonator, the optical pump line configured to transmit the quantum information as an optical frequency signal.

4. The system of Claim 3, wherein the device configured to operate in the optical frequency domain comprises a bulk acoustic wave resonator, a mechanical coupler, or a membrane.

said conversion chip comprising a plurality of conversion qubits, at least one of said plurality of conversion qubits being coupled to said microwave-to-optical frequency converter, said plurality of superconducting microwave waveguides converting quantum information to said 7. The system of any of claims 1-6, configured to transmit from a plurality of data qubits via microwave photons to the plurality of transform qubits.

4. The conversion chip further comprising a plurality of microwave-to-optical frequency converters, each of the plurality of conversion qubits being coupled to one of the plurality of microwave-to-optical frequency converters. 7. The system according to 7.

each of the plurality of data qubits has a relaxation time and a coherence time sufficient to perform quantum computation; and each of the plurality of transform qubits has a transform time of the microwave-to-optical frequency converter. 9. The system of claim 8, having relaxation and coherence times greater than .

10. A system according to any preceding claim, wherein the conversion chip comprises a substrate comprising electro-optical or piezoelectric material or a silicon-on-insulator substrate.

The system of any of claims 1-10, wherein the microwave-to-optical frequency converter comprises an opto-mechanical system.

The interposer has a first surface and a second surface opposite the first surface, the qubit chip is coupled to the first surface, and the conversion chip is coupled to the second surface. 12. The system of any of claims 1-11, wherein the system is bonded to a surface.

13. The system of any of claims 1-12, wherein the qubit chip and the conversion chip are bonded to the same surface of the interposer.

4. The dielectric material comprises one or more selected from the group consisting of Si wafers, printed circuit boards, organic laminates, ceramics, glass reinforced epoxy laminate materials, duroid, PEEK, and Teflon. 14. The system according to any one of 1-13.

A method for performing optical conversion of quantum information, comprising:
providing a qubit chip including a plurality of data qubits configured to operate at microwave frequencies;
transferring quantum information from the plurality of data qubits to a conversion chip spaced from the qubit chip, the transferring chip comprising a microwave-to-optical frequency converter;
performing microwave-to-optical frequency conversion of the quantum information while shielding the plurality of data qubits from stray light fields using a dielectric interposer positioned between the qubit chip and the conversion chip. and
outputting the quantum information as an optical frequency signal;
A method for performing optical conversion of quantum information, comprising:

a quantum computer,
a cooling system under vacuum comprising a containment vessel;
15. The system of any of claims 1-14, wherein the system is housed within a cooled vacuum environment defined by the containment vessel;
Quantum computer.

17. The quantum computer of claim 16, wherein the optical pump line is configured to transmit the quantum information as an optical frequency signal from the cooled vacuum environment defined by the containment vessel to the exterior of the containment vessel. .

The conversion chip further comprises an optical pump line coupled to an optical ring resonator, the optical pump line coupling the quantum information as an optical frequency signal from the conversion chip to a second qubit chip. 18. A quantum computer as claimed in claim 16 or 17, arranged to transmit to a second conversion chip.