JPWO2020235647A1 - - Google Patents
Info
- Publication number
- JPWO2020235647A1 JPWO2020235647A1 JP2021520855A JP2021520855A JPWO2020235647A1 JP WO2020235647 A1 JPWO2020235647 A1 JP WO2020235647A1 JP 2021520855 A JP2021520855 A JP 2021520855A JP 2021520855 A JP2021520855 A JP 2021520855A JP WO2020235647 A1 JPWO2020235647 A1 JP WO2020235647A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019096803 | 2019-05-23 | ||
| JP2019096803 | 2019-05-23 | ||
| PCT/JP2020/020164 WO2020235647A1 (en) | 2019-05-23 | 2020-05-21 | Electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2020235647A1 true JPWO2020235647A1 (en) | 2020-11-26 |
| JP7253048B2 JP7253048B2 (en) | 2023-04-05 |
Family
ID=73458191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021520855A Active JP7253048B2 (en) | 2019-05-23 | 2020-05-21 | Electronics |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7253048B2 (en) |
| WO (1) | WO2020235647A1 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005129873A (en) * | 2003-10-27 | 2005-05-19 | Sanyo Electric Co Ltd | Circuit device |
| JP2006513556A (en) * | 2002-04-10 | 2006-04-20 | ゴア エンタープライズ ホールディングス，インコーポレイティド | Substrate level EMI shield with improved heat dissipation |
| US20160301442A1 (en) * | 2015-04-08 | 2016-10-13 | Samsung Electronics Co., Ltd. | Noise shielding device with heat dissipation structure and electronic device having the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10026353A1 (en) * | 2000-05-27 | 2001-11-29 | Mannesmann Vdo Ag | Shielded electronic circuit |
| JP2005294342A (en) * | 2004-03-31 | 2005-10-20 | Clarion Co Ltd | Cooling/shielding structure of electronic component |
| US20170181266A1 (en) * | 2015-12-22 | 2017-06-22 | Thomson Licensing | Electronic circuit board shielding with open window heat transfer path |
-
2020
- 2020-05-21 JP JP2021520855A patent/JP7253048B2/en active Active
- 2020-05-21 WO PCT/JP2020/020164 patent/WO2020235647A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006513556A (en) * | 2002-04-10 | 2006-04-20 | ゴア エンタープライズ ホールディングス，インコーポレイティド | Substrate level EMI shield with improved heat dissipation |
| JP2005129873A (en) * | 2003-10-27 | 2005-05-19 | Sanyo Electric Co Ltd | Circuit device |
| US20160301442A1 (en) * | 2015-04-08 | 2016-10-13 | Samsung Electronics Co., Ltd. | Noise shielding device with heat dissipation structure and electronic device having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7253048B2 (en) | 2023-04-05 |
| WO2020235647A1 (en) | 2020-11-26 |
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