JPWO2020219837A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2020219837A5 JPWO2020219837A5 JP2021577577A JP2021577577A JPWO2020219837A5 JP WO2020219837 A5 JPWO2020219837 A5 JP WO2020219837A5 JP 2021577577 A JP2021577577 A JP 2021577577A JP 2021577577 A JP2021577577 A JP 2021577577A JP WO2020219837 A5 JPWO2020219837 A5 JP WO2020219837A5
- Authority
- JP
- Japan
- Prior art keywords
- aperture
- conductive tapered
- conductive
- interface substrate
- interface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 206
- 239000007787 solid Substances 0.000 claims description 49
- 239000000463 material Substances 0.000 claims description 42
- 230000005540 biological transmission Effects 0.000 claims description 22
- 239000000789 fastener Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 150000003071 polychlorinated biphenyls Chemical class 0.000 claims description 22
- 230000000875 corresponding Effects 0.000 claims description 20
- 230000023298 conjugation with cellular fusion Effects 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 6
- 230000013011 mating Effects 0.000 claims description 6
- 230000021037 unidirectional conjugation Effects 0.000 claims description 6
- 230000001808 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims 1
- 239000002365 multiple layer Substances 0.000 claims 1
- 239000003989 dielectric material Substances 0.000 description 40
- 239000004020 conductor Substances 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000005192 partition Methods 0.000 description 10
- 210000003491 Skin Anatomy 0.000 description 8
- 238000004891 communication Methods 0.000 description 8
- 238000002955 isolation Methods 0.000 description 7
- 239000000654 additive Substances 0.000 description 6
- 230000000996 additive Effects 0.000 description 6
- 230000003750 conditioning Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 238000005388 cross polarization Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000006011 modification reaction Methods 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 230000001702 transmitter Effects 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- VLLVVZDKBSYMCG-UHFFFAOYSA-N 1,3,5-trichloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=CC=CC=C1Cl VLLVVZDKBSYMCG-UHFFFAOYSA-N 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N Acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 229920000122 Acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000001934 delay Effects 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000001427 coherent Effects 0.000 description 1
- 230000000295 complement Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000001419 dependent Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000001066 destructive Effects 0.000 description 1
- 230000001627 detrimental Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000873 masking Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000002093 peripheral Effects 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000011045 prefiltration Methods 0.000 description 1
- 230000002250 progressing Effects 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000036633 rest Effects 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962839125P | 2019-04-26 | 2019-04-26 | |
| US201962839131P | 2019-04-26 | 2019-04-26 | |
| US62/839,131 | 2019-04-26 | ||
| US62/839,125 | 2019-04-26 | ||
| US201962842816P | 2019-05-03 | 2019-05-03 | |
| US62/842,816 | 2019-05-03 | ||
| PCT/US2020/029760 WO2020219837A1 (en) | 2019-04-26 | 2020-04-24 | Systems and methods for signal communication with scalable, modular network nodes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022536407A JP2022536407A (ja) | 2022-08-15 |
| JPWO2020219837A5 true JPWO2020219837A5 (es) | 2022-11-28 |
Family
ID=70922117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021577577A Pending JP2022536407A (ja) | 2019-04-26 | 2020-04-24 | スケーラブルなモジュール式ネットワークノードを伴う信号通信システムおよび方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (9) | US11038545B2 (es) |
| EP (1) | EP3959774A1 (es) |
| JP (1) | JP2022536407A (es) |
| KR (1) | KR20220002453A (es) |
| AU (1) | AU2020262934A1 (es) |
| CA (3) | CA3200701A1 (es) |
| WO (2) | WO2020219837A1 (es) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11038545B2 (en) * | 2019-04-26 | 2021-06-15 | Battelle Memorial Institute | Systems and methods for signal communication with scalable, modular network nodes |
| US11936415B2 (en) | 2019-05-03 | 2024-03-19 | Battelle Memorial Institute | Modular radio frequency aperture |
| US11497118B2 (en) * | 2021-02-12 | 2022-11-08 | Raytheon Company | Method for manufacturing non-planar arrays with a single flex-hybrid circuit card |
| JP2024520390A (ja) * | 2021-05-24 | 2024-05-24 | バテル メモリアル インスティチュート | ブロードバンドアナログフロントエンドを伴うマルチバンドデジタルデータネットワークインフラストラクチャ |
| US11616522B1 (en) * | 2021-09-29 | 2023-03-28 | Gulfstream Aerospace Corporation | Aircraft radio communication system with reduced number of antennas |
| KR20240093925A (ko) * | 2021-10-29 | 2024-06-24 | 바텔리 메모리얼 인스티튜트 | 차동 분할 개구 안테나용 회로 아키텍쳐 |
| US11909117B1 (en) * | 2022-08-02 | 2024-02-20 | Battelle Memorial Institute | Multi-function scalable antenna array |
| WO2024030297A1 (en) | 2022-08-05 | 2024-02-08 | Battelle Memorial Institute | Broadband radio frequency imaging surface |
| US11967767B1 (en) | 2023-04-26 | 2024-04-23 | Battelle Memorial Institute | Air interface plane for radio frequency aperture |
| US11901930B1 (en) | 2023-04-26 | 2024-02-13 | Battelle Memorial Institute | Radio frequency aperture with cooling assembly |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD281969S (en) * | 1983-02-04 | 1985-12-31 | Danfoss A/S | Casing for electrical apparatus or the like |
| USD287718S (en) * | 1985-12-09 | 1987-01-13 | Danfoss A/S | Casing for an electronic AC speed control unit |
| JPH08181530A (ja) | 1994-12-22 | 1996-07-12 | Matsushita Electric Works Ltd | マイクロストリップアンテナの共振周波数調整方法 |
| US5703599A (en) * | 1996-02-26 | 1997-12-30 | Hughes Electronics | Injection molded offset slabline RF feedthrough for active array aperture interconnect |
| WO2003023987A1 (en) | 2001-09-07 | 2003-03-20 | Remec, Inc. | Transceiver assembly |
| US20060038732A1 (en) * | 2003-07-11 | 2006-02-23 | Deluca Mark R | Broadband dual polarized slotline feed circuit |
| DE102004039743A1 (de) * | 2004-08-17 | 2006-02-23 | Robert Bosch Gmbh | Antennenstruktur mit Patch-Elementen |
| US7420522B1 (en) | 2004-09-29 | 2008-09-02 | The United States Of America As Represented By The Secretary Of The Navy | Electromagnetic radiation interface system and method |
| US7583074B1 (en) * | 2005-12-16 | 2009-09-01 | Hrl Laboratories, Llc | Low cost millimeter wave imager |
| US8564491B2 (en) * | 2008-04-05 | 2013-10-22 | Sheng Peng | Wideband high gain antenna |
| US8648757B2 (en) * | 2010-04-30 | 2014-02-11 | Raytheon Company | End-loaded topology for D-plane polarization improvement |
| US8648759B2 (en) * | 2011-09-30 | 2014-02-11 | Raytheon Company | Variable height radiating aperture |
| US20140055961A1 (en) | 2012-08-23 | 2014-02-27 | Shayan Malek | Printed Circuit Boards with Recesses |
| USD733104S1 (en) * | 2013-01-18 | 2015-06-30 | Airgain, Inc. | Maximum beam antenna |
| USD710832S1 (en) * | 2013-03-13 | 2014-08-12 | Airgain, Inc. | Antenna |
| US9496592B2 (en) | 2014-03-27 | 2016-11-15 | Intel Corporation | Rack level pre-installed interconnect for enabling cableless server/storage/networking deployment |
| USD754108S1 (en) * | 2014-10-29 | 2016-04-19 | Airgain, Inc. | Antenna |
| US9991605B2 (en) | 2015-06-16 | 2018-06-05 | The Mitre Corporation | Frequency-scaled ultra-wide spectrum element |
| US10056699B2 (en) | 2015-06-16 | 2018-08-21 | The Mitre Cooperation | Substrate-loaded frequency-scaled ultra-wide spectrum element |
| US10523306B2 (en) | 2016-08-23 | 2019-12-31 | Laird Technologies, Inc. | Omnidirectional multiband symmetrical dipole antennas |
| US9602143B1 (en) | 2016-12-16 | 2017-03-21 | The United States Of America As Represented By The Secretary Of The Navy | System and method for generating wireless electromagnetic transmissions modulated with software defined complex waveforms |
| CN111788876B (zh) * | 2017-12-08 | 2023-07-07 | 株式会社Kmw | 电子元件的散热装置 |
| US10651566B2 (en) | 2018-04-23 | 2020-05-12 | The Boeing Company | Unit cell antenna for phased arrays |
| CN110492216A (zh) * | 2018-05-15 | 2019-11-22 | 康普技术有限责任公司 | 具有完全内嵌无线电和带集成散热结构的壳体的基站天线 |
| US10833399B1 (en) * | 2018-08-30 | 2020-11-10 | Bae Systems Information And Electronic Systems Integration Inc. | Embedded wide band monocone antenna |
| US11038545B2 (en) | 2019-04-26 | 2021-06-15 | Battelle Memorial Institute | Systems and methods for signal communication with scalable, modular network nodes |
| JP1654517S (ja) * | 2019-07-24 | 2020-03-09 | 無線送受信モジュール | |
| EP4128545A1 (en) | 2020-04-03 | 2023-02-08 | All.Space Networks Limited | Field-assembled modular phased array satcom terminal |
| US20230269498A1 (en) | 2020-07-20 | 2023-08-24 | Sony Group Corporation | Information processing device, information processing system, information processing method, and information processing program |
| US20220123471A1 (en) * | 2020-10-15 | 2022-04-21 | Commscope Technologies Llc | Patch radiating element and antenna assembly |
| EP4102734A1 (en) | 2021-06-09 | 2022-12-14 | Nokia Technologies Oy | An apparatus that supports spatial diversity, at least at reception |
-
2020
- 2020-04-24 US US16/858,125 patent/US11038545B2/en active Active
- 2020-04-24 CA CA3200701A patent/CA3200701A1/en active Pending
- 2020-04-24 US US16/858,206 patent/US11342955B2/en active Active
- 2020-04-24 CA CA3137281A patent/CA3137281A1/en active Pending
- 2020-04-24 CA CA3200775A patent/CA3200775A1/en active Pending
- 2020-04-24 KR KR1020217038270A patent/KR20220002453A/ko not_active Application Discontinuation
- 2020-04-24 WO PCT/US2020/029760 patent/WO2020219837A1/en unknown
- 2020-04-24 JP JP2021577577A patent/JP2022536407A/ja active Pending
- 2020-04-24 EP EP20729868.8A patent/EP3959774A1/en active Pending
- 2020-04-24 US US16/858,169 patent/US11057072B2/en active Active
- 2020-04-24 AU AU2020262934A patent/AU2020262934A1/en active Pending
-
2021
- 2021-01-05 US US17/141,796 patent/US11552670B2/en active Active
- 2021-07-08 US US29/798,569 patent/USD991231S1/en active Active
- 2021-07-08 US US29/798,561 patent/USD992535S1/en active Active
- 2021-07-08 US US29/798,551 patent/USD1046830S1/en active Active
-
2022
- 2022-11-22 US US17/992,203 patent/US11742888B2/en active Active
-
2023
- 2023-04-26 WO PCT/US2023/019985 patent/WO2024112363A1/en unknown
- 2023-07-07 US US18/219,282 patent/US12052046B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11038545B2 (en) | Systems and methods for signal communication with scalable, modular network nodes | |
| US11901930B1 (en) | Radio frequency aperture with cooling assembly | |
| US11145977B2 (en) | Interlocking modular beamformer | |
| US11942688B2 (en) | Conformal/omni-directional differential segmented aperture | |
| US11362432B2 (en) | Differential segmented aperture | |
| JPWO2020219837A5 (es) | ||
| US11967767B1 (en) | Air interface plane for radio frequency aperture | |
| US11936415B2 (en) | Modular radio frequency aperture | |
| JPWO2020219794A5 (es) | ||
| US20240283154A1 (en) | Bandwidth extended balanced tightly coupled dipole array additively manufactured modular aperture | |
| JPWO2020220055A5 (es) |