JPWO2020218468A1 - - Google Patents

Info

Publication number
JPWO2020218468A1
JPWO2020218468A1 JP2021516232A JP2021516232A JPWO2020218468A1 JP WO2020218468 A1 JPWO2020218468 A1 JP WO2020218468A1 JP 2021516232 A JP2021516232 A JP 2021516232A JP 2021516232 A JP2021516232 A JP 2021516232A JP WO2020218468 A1 JPWO2020218468 A1 JP WO2020218468A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021516232A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020218468A1 publication Critical patent/JPWO2020218468A1/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/24Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07Flat, e.g. panels
    • B29C48/08Flat, e.g. panels flexible, e.g. films
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/09Articles with cross-sections having partially or fully enclosed cavities, e.g. pipes or channels
    • B29C48/10Articles with cross-sections having partially or fully enclosed cavities, e.g. pipes or channels flexible, e.g. blown foils
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/30Extrusion nozzles or dies
    • B29C48/305Extrusion nozzles or dies having a wide opening, e.g. for forming sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/88Thermal treatment of the stream of extruded material, e.g. cooling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10Homopolymers or copolymers of propene
    • C08L23/12Polypropene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10Homopolymers or copolymers of propene
    • C08L23/14Copolymers of propene
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
JP2021516232A 2019-04-25 2020-04-24 Pending JPWO2020218468A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019083514 2019-04-25
PCT/JP2020/017603 WO2020218468A1 (en) 2019-04-25 2020-04-24 Substrate film for dicing film, dicing film, and production method

Publications (1)

Publication Number Publication Date
JPWO2020218468A1 true JPWO2020218468A1 (en) 2020-10-29

Family

ID=72942184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021516232A Pending JPWO2020218468A1 (en) 2019-04-25 2020-04-24

Country Status (5)

Country Link
JP (1) JPWO2020218468A1 (en)
KR (1) KR20220005444A (en)
CN (1) CN113728048B (en)
TW (1) TWI821560B (en)
WO (1) WO2020218468A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7111213B1 (en) 2021-04-22 2022-08-02 大日本印刷株式会社 Adhesive tape for semiconductor processing
CN113429608A (en) * 2021-07-12 2021-09-24 东莞市卓一达新材料有限公司 High-precision wafer scribing substrate film and preparation method thereof
JP7188658B1 (en) * 2021-09-27 2022-12-13 昭和電工マテリアルズ株式会社 Semiconductor device manufacturing method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1180233A (en) * 1997-07-11 1999-03-26 Sumitomo Chem Co Ltd Propylene copolymer, production of propylene copolymer, compounding ingredient for polyolefin resin and thermoplastic resin composition
JP2000025174A (en) * 1998-07-10 2000-01-25 Ube Ind Ltd Multilayered laminate
JP2003313434A (en) * 2002-02-25 2003-11-06 Sumitomo Chem Co Ltd Thermoplastic elastomer composition
BRPI0809743B1 (en) * 2007-04-24 2019-02-26 Dow Global Technologies Inc. POLYMER COMPOSITION AND THERMOFORMED MOLDED ARTICLE
EP2226357B1 (en) * 2007-12-27 2018-02-28 Mitsui Chemicals, Inc. Propylene polymer composition
JP5427369B2 (en) 2008-05-29 2014-02-26 アキレス株式会社 Base film for semiconductor manufacturing tape
US9725540B2 (en) 2009-11-06 2017-08-08 Mitsui Chemicals, Inc. 4-methyl-1-pentene/α-olefin copolymer, composition comprising the copolymer and 4-methyl-1-pentene copolymer composition
CN103154100A (en) * 2010-08-12 2013-06-12 北欧化工公司 Easy tear polypropylene film without notch
WO2015005049A1 (en) * 2013-07-10 2015-01-15 リケンテクノス株式会社 Poly(meth)acrylimide film, easy-adhesion film using same, and method for manufacturing such films
JP6466059B2 (en) 2013-11-12 2019-02-06 三井化学株式会社 the film
JP6542502B2 (en) 2013-11-15 2019-07-10 三井化学株式会社 Expandable substrate film, dicing film, surface protection film for semiconductor, and method for manufacturing semiconductor device
CN105623079B (en) * 2014-11-03 2018-04-10 中国石油化工股份有限公司 Polymer film and preparation method thereof
JP6412411B2 (en) 2014-11-11 2018-10-24 ダイヤプラスフィルム株式会社 Base film used for adhesive film for semiconductor manufacturing process
JP6242351B2 (en) 2015-01-05 2017-12-06 グンゼ株式会社 Dicing substrate film, dicing film, and manufacturing method of dicing substrate film

Also Published As

Publication number Publication date
WO2020218468A1 (en) 2020-10-29
TWI821560B (en) 2023-11-11
TW202041587A (en) 2020-11-16
CN113728048A (en) 2021-11-30
KR20220005444A (en) 2022-01-13
CN113728048B (en) 2023-11-03

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