JPWO2020203670A1 - - Google Patents
Info
- Publication number
- JPWO2020203670A1 JPWO2020203670A1 JP2021511939A JP2021511939A JPWO2020203670A1 JP WO2020203670 A1 JPWO2020203670 A1 JP WO2020203670A1 JP 2021511939 A JP2021511939 A JP 2021511939A JP 2021511939 A JP2021511939 A JP 2021511939A JP WO2020203670 A1 JPWO2020203670 A1 JP WO2020203670A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019068595 | 2019-03-29 | ||
JP2019068595 | 2019-03-29 | ||
PCT/JP2020/013751 WO2020203670A1 (fr) | 2019-03-29 | 2020-03-26 | Solution de traitement et procédé de formation de motif |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020203670A1 true JPWO2020203670A1 (fr) | 2020-10-08 |
JP7292378B2 JP7292378B2 (ja) | 2023-06-16 |
Family
ID=72667775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021511939A Active JP7292378B2 (ja) | 2019-03-29 | 2020-03-26 | 処理液、パターン形成方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7292378B2 (fr) |
WO (1) | WO2020203670A1 (fr) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016136476A1 (fr) * | 2015-02-27 | 2016-09-01 | 富士フイルム株式会社 | Procédé de formation de motifs, composition de résine sensible à une lumière active ou sensible à un rayonnement, film sensible à une lumière active ou sensible à un rayonnement, procédé de fabrication de dispositif électronique et dispositif électronique |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101869312B1 (ko) * | 2014-07-31 | 2018-06-20 | 후지필름 가부시키가이샤 | 패턴 형성 방법, 레지스트 패턴, 전자 디바이스의 제조 방법, 및 전자 디바이스 |
KR102038942B1 (ko) * | 2015-06-24 | 2019-10-31 | 후지필름 가부시키가이샤 | 패턴 형성 방법, 적층체, 및 유기 용제 현상용 레지스트 조성물 |
JP6582053B2 (ja) * | 2015-09-30 | 2019-09-25 | 富士フイルム株式会社 | 感活性光線又は感放射線性組成物、並びに、これを用いたレジスト膜、パターン形成方法及び電子デバイスの製造方法 |
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2020
- 2020-03-26 JP JP2021511939A patent/JP7292378B2/ja active Active
- 2020-03-26 WO PCT/JP2020/013751 patent/WO2020203670A1/fr active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016136476A1 (fr) * | 2015-02-27 | 2016-09-01 | 富士フイルム株式会社 | Procédé de formation de motifs, composition de résine sensible à une lumière active ou sensible à un rayonnement, film sensible à une lumière active ou sensible à un rayonnement, procédé de fabrication de dispositif électronique et dispositif électronique |
Also Published As
Publication number | Publication date |
---|---|
TW202041614A (zh) | 2020-11-16 |
WO2020203670A1 (fr) | 2020-10-08 |
JP7292378B2 (ja) | 2023-06-16 |
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