JPWO2020203670A1 - - Google Patents

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Publication number
JPWO2020203670A1
JPWO2020203670A1 JP2021511939A JP2021511939A JPWO2020203670A1 JP WO2020203670 A1 JPWO2020203670 A1 JP WO2020203670A1 JP 2021511939 A JP2021511939 A JP 2021511939A JP 2021511939 A JP2021511939 A JP 2021511939A JP WO2020203670 A1 JPWO2020203670 A1 JP WO2020203670A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021511939A
Other languages
Japanese (ja)
Other versions
JP7292378B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020203670A1 publication Critical patent/JPWO2020203670A1/ja
Application granted granted Critical
Publication of JP7292378B2 publication Critical patent/JP7292378B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
JP2021511939A 2019-03-29 2020-03-26 Treatment liquid, pattern forming method Active JP7292378B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019068595 2019-03-29
JP2019068595 2019-03-29
PCT/JP2020/013751 WO2020203670A1 (en) 2019-03-29 2020-03-26 Process solution and pattern-forming method

Publications (2)

Publication Number Publication Date
JPWO2020203670A1 true JPWO2020203670A1 (en) 2020-10-08
JP7292378B2 JP7292378B2 (en) 2023-06-16

Family

ID=72667775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021511939A Active JP7292378B2 (en) 2019-03-29 2020-03-26 Treatment liquid, pattern forming method

Country Status (3)

Country Link
JP (1) JP7292378B2 (en)
TW (1) TW202041614A (en)
WO (1) WO2020203670A1 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016136476A1 (en) * 2015-02-27 2016-09-01 富士フイルム株式会社 Pattern forming method, active light sensitive or radiation sensitive resin composition, active light sensitive or radiation sensitive film, method for manufacturing electronic device, and electronic device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016017232A1 (en) * 2014-07-31 2016-02-04 富士フイルム株式会社 Pattern forming method, resist pattern, method for manufacturing electronic device, and electronic device
JP6457640B2 (en) * 2015-06-24 2019-01-23 富士フイルム株式会社 Pattern forming method, laminate, and resist composition for organic solvent development
JP6582053B2 (en) * 2015-09-30 2019-09-25 富士フイルム株式会社 Actinic ray or radiation sensitive composition, and resist film, pattern forming method and electronic device manufacturing method using the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016136476A1 (en) * 2015-02-27 2016-09-01 富士フイルム株式会社 Pattern forming method, active light sensitive or radiation sensitive resin composition, active light sensitive or radiation sensitive film, method for manufacturing electronic device, and electronic device

Also Published As

Publication number Publication date
JP7292378B2 (en) 2023-06-16
WO2020203670A1 (en) 2020-10-08
TW202041614A (en) 2020-11-16

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