JPWO2020203611A1 - - Google Patents
Info
- Publication number
- JPWO2020203611A1 JPWO2020203611A1 JP2021511899A JP2021511899A JPWO2020203611A1 JP WO2020203611 A1 JPWO2020203611 A1 JP WO2020203611A1 JP 2021511899 A JP2021511899 A JP 2021511899A JP 2021511899 A JP2021511899 A JP 2021511899A JP WO2020203611 A1 JPWO2020203611 A1 JP WO2020203611A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/856—Thermoelectric active materials comprising organic compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019069129 | 2019-03-29 | ||
| PCT/JP2020/013551 WO2020203611A1 (en) | 2019-03-29 | 2020-03-26 | Method for forming solder receiving layer on chip of thermoelectric conversion material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2020203611A1 true JPWO2020203611A1 (en) | 2020-10-08 |
Family
ID=72668148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021511899A Pending JPWO2020203611A1 (en) | 2019-03-29 | 2020-03-26 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2020203611A1 (en) |
| TW (1) | TW202105777A (en) |
| WO (1) | WO2020203611A1 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4383056B2 (en) * | 2003-01-09 | 2009-12-16 | 古河電気工業株式会社 | Method for manufacturing thermoelectric module |
| JP2004235368A (en) * | 2003-01-29 | 2004-08-19 | Kyocera Corp | Thermoelectric crystal and method for manufacturing thermoelectric module |
| WO2016104615A1 (en) * | 2014-12-26 | 2016-06-30 | リンテック株式会社 | Peltier cooling element and method for manufacturing same |
| JP6586352B2 (en) * | 2015-11-12 | 2019-10-02 | 日東電工株式会社 | Manufacturing method of semiconductor device |
-
2020
- 2020-03-26 JP JP2021511899A patent/JPWO2020203611A1/ja active Pending
- 2020-03-26 WO PCT/JP2020/013551 patent/WO2020203611A1/en active Application Filing
- 2020-03-27 TW TW109110415A patent/TW202105777A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020203611A1 (en) | 2020-10-08 |
| TW202105777A (en) | 2021-02-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20221228 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230808 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20240213 |