JPWO2020203502A1 - - Google Patents

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Publication number
JPWO2020203502A1
JPWO2020203502A1 JP2021511513A JP2021511513A JPWO2020203502A1 JP WO2020203502 A1 JPWO2020203502 A1 JP WO2020203502A1 JP 2021511513 A JP2021511513 A JP 2021511513A JP 2021511513 A JP2021511513 A JP 2021511513A JP WO2020203502 A1 JPWO2020203502 A1 JP WO2020203502A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021511513A
Other languages
Japanese (ja)
Other versions
JP7234348B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020203502A1 publication Critical patent/JPWO2020203502A1/ja
Application granted granted Critical
Publication of JP7234348B2 publication Critical patent/JP7234348B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
JP2021511513A 2019-04-05 2020-03-24 Photosensitive transfer material, resin pattern manufacturing method, circuit wiring manufacturing method, and touch panel manufacturing method Active JP7234348B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019072459 2019-04-05
JP2019072459 2019-04-05
PCT/JP2020/013147 WO2020203502A1 (en) 2019-04-05 2020-03-24 Photosensitive transfer material, method for producing resin pattern, method for producing circuit wiring line, and method for producing touch panel

Publications (2)

Publication Number Publication Date
JPWO2020203502A1 true JPWO2020203502A1 (en) 2020-10-08
JP7234348B2 JP7234348B2 (en) 2023-03-07

Family

ID=72669062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021511513A Active JP7234348B2 (en) 2019-04-05 2020-03-24 Photosensitive transfer material, resin pattern manufacturing method, circuit wiring manufacturing method, and touch panel manufacturing method

Country Status (4)

Country Link
JP (1) JP7234348B2 (en)
KR (1) KR102648550B1 (en)
CN (1) CN113678062A (en)
WO (1) WO2020203502A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113994262A (en) * 2019-08-20 2022-01-28 富士胶片株式会社 Photosensitive transfer member, method for manufacturing resin pattern, method for manufacturing circuit wiring, and method for manufacturing touch panel
WO2022044831A1 (en) * 2020-08-25 2022-03-03 富士フイルム株式会社 Photosensitive transfer material, method for producing resin pattern, method for producing circuit wiring, and method for producing touch panel

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005148236A (en) * 2003-11-12 2005-06-09 Fuji Photo Film Co Ltd Dry film photoresist
JP2006003436A (en) * 2004-06-15 2006-01-05 Fuji Photo Film Co Ltd Pattern forming material, pattern forming apparatus, and pattern forming method
JP2016099374A (en) * 2014-11-18 2016-05-30 日立化成株式会社 Photosensitive element, method for manufacturing substrate with resist pattern, method for manufacturing printed wiring board, and method for manufacturing touch panel
JP2016188922A (en) * 2015-03-30 2016-11-04 日立化成株式会社 Photosensitive resin composition, photosensitive element, method for manufacturing substrate with resist pattern, method for manufacturing printed wiring board, and method for manufacturing touch panel

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008009030A (en) * 2006-06-28 2008-01-17 Fujifilm Corp Photosensitive transfer material, laminate and method for producing the same, substrate for liquid crystal display device, liquid crystal display element, and liquid crystal display device
CN109154775A (en) * 2016-05-31 2019-01-04 富士胶片株式会社 Photosensitive polymer combination, transfer film, the manufacturing method of pattern, decorative pattern and touch panel
KR102110818B1 (en) * 2016-06-10 2020-05-14 후지필름 가부시키가이샤 Method for manufacturing a substrate on which a pattern is formed, and method for manufacturing a circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005148236A (en) * 2003-11-12 2005-06-09 Fuji Photo Film Co Ltd Dry film photoresist
JP2006003436A (en) * 2004-06-15 2006-01-05 Fuji Photo Film Co Ltd Pattern forming material, pattern forming apparatus, and pattern forming method
JP2016099374A (en) * 2014-11-18 2016-05-30 日立化成株式会社 Photosensitive element, method for manufacturing substrate with resist pattern, method for manufacturing printed wiring board, and method for manufacturing touch panel
JP2016188922A (en) * 2015-03-30 2016-11-04 日立化成株式会社 Photosensitive resin composition, photosensitive element, method for manufacturing substrate with resist pattern, method for manufacturing printed wiring board, and method for manufacturing touch panel

Also Published As

Publication number Publication date
JP7234348B2 (en) 2023-03-07
WO2020203502A1 (en) 2020-10-08
KR102648550B1 (en) 2024-03-18
CN113678062A (en) 2021-11-19
KR20210137102A (en) 2021-11-17

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