JPWO2020195843A1 - - Google Patents

Info

Publication number
JPWO2020195843A1
JPWO2020195843A1 JP2021509008A JP2021509008A JPWO2020195843A1 JP WO2020195843 A1 JPWO2020195843 A1 JP WO2020195843A1 JP 2021509008 A JP2021509008 A JP 2021509008A JP 2021509008 A JP2021509008 A JP 2021509008A JP WO2020195843 A1 JPWO2020195843 A1 JP WO2020195843A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021509008A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020195843A1 publication Critical patent/JPWO2020195843A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
JP2021509008A 2019-03-26 2020-03-11 Pending JPWO2020195843A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019059068 2019-03-26
PCT/JP2020/010575 WO2020195843A1 (en) 2019-03-26 2020-03-11 Dry film, cured article, and electronic component

Publications (1)

Publication Number Publication Date
JPWO2020195843A1 true JPWO2020195843A1 (en) 2020-10-01

Family

ID=72611373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021509008A Pending JPWO2020195843A1 (en) 2019-03-26 2020-03-11

Country Status (5)

Country Link
JP (1) JPWO2020195843A1 (en)
KR (1) KR20210145772A (en)
CN (1) CN113614153A (en)
TW (1) TW202108362A (en)
WO (1) WO2020195843A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115926576A (en) * 2022-12-13 2023-04-07 东莞市毅联电子科技有限公司 Shading coating for flexible circuit board and preparation method and use method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005238469A (en) * 2004-02-24 2005-09-08 Tosoh Corp Laminate
TWI584070B (en) * 2012-04-23 2017-05-21 日立化成股份有限公司 Photosensitive resin composition, photosensitive film, permanent mask resist and method for manufacturing permanent mask resist
JP5624184B1 (en) 2013-06-28 2014-11-12 太陽インキ製造株式会社 Dry film and printed wiring board
JP6289311B2 (en) * 2014-08-29 2018-03-07 積水化成品工業株式会社 Adhesive composition, adhesive sheet, adhesion method for adherend and composite material
JP6665627B2 (en) * 2016-03-28 2020-03-13 日本ゼオン株式会社 Resin composition and electronic parts

Also Published As

Publication number Publication date
TW202108362A (en) 2021-03-01
CN113614153A (en) 2021-11-05
KR20210145772A (en) 2021-12-02
WO2020195843A1 (en) 2020-10-01

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