JPWO2020195460A1 - - Google Patents

Info

Publication number
JPWO2020195460A1
JPWO2020195460A1 JP2021508830A JP2021508830A JPWO2020195460A1 JP WO2020195460 A1 JPWO2020195460 A1 JP WO2020195460A1 JP 2021508830 A JP2021508830 A JP 2021508830A JP 2021508830 A JP2021508830 A JP 2021508830A JP WO2020195460 A1 JPWO2020195460 A1 JP WO2020195460A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021508830A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020195460A1 publication Critical patent/JPWO2020195460A1/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
  • Push-Button Switches (AREA)
JP2021508830A 2019-03-25 2020-02-25 Pending JPWO2020195460A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019057497 2019-03-25
PCT/JP2020/007488 WO2020195460A1 (ja) 2019-03-25 2020-02-25 感圧部材及び圧力検出装置

Publications (1)

Publication Number Publication Date
JPWO2020195460A1 true JPWO2020195460A1 (zh) 2020-10-01

Family

ID=72609187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021508830A Pending JPWO2020195460A1 (zh) 2019-03-25 2020-02-25

Country Status (2)

Country Link
JP (1) JPWO2020195460A1 (zh)
WO (1) WO2020195460A1 (zh)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997013130A2 (de) * 1995-09-12 1997-04-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektronisches bauelement zur statischen und dynamischen druckerfassung
JPH1183644A (ja) * 1997-09-08 1999-03-26 Toyo Polymer Kk 感圧センサー
JP2001195945A (ja) * 2000-01-06 2001-07-19 Polymatech Co Ltd 感圧導電センサー
JP2002506216A (ja) * 1998-03-11 2002-02-26 ゲンコープ プロパティ インコーポレイティド 力反応式検出器及びシステム、並びにそれらの製造方法
JP2006513408A (ja) * 2003-01-07 2006-04-20 アイイーイー インターナショナル エレクトロニクス アンド エンジニアリング エス．エイ． 微細構造化面をもつ弾性センサ層で構成される圧力センサ
JP2009298063A (ja) * 2008-06-16 2009-12-24 Nippon Zeon Co Ltd 積層体及び配線基板
WO2011024902A1 (ja) * 2009-08-28 2011-03-03 日本写真印刷株式会社 圧力検出ユニット及び圧力検出装置
JP2012145447A (ja) * 2011-01-12 2012-08-02 Canon Chemicals Inc 感圧導電ゴム部材及び感圧センサ
JP2012159463A (ja) * 2011-02-02 2012-08-23 Canon Chemicals Inc 感圧センサ体
US20120256720A1 (en) * 2011-04-08 2012-10-11 Samsung Electronics Co., Ltd. Bending sensor and method for fabricating the same
JP2014163815A (ja) * 2013-02-26 2014-09-08 Seiko Epson Corp 力検出装置およびロボット
JP2017009559A (ja) * 2015-06-26 2017-01-12 ヤマハ株式会社 歪みセンサ素子

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997013130A2 (de) * 1995-09-12 1997-04-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektronisches bauelement zur statischen und dynamischen druckerfassung
JPH1183644A (ja) * 1997-09-08 1999-03-26 Toyo Polymer Kk 感圧センサー
JP2002506216A (ja) * 1998-03-11 2002-02-26 ゲンコープ プロパティ インコーポレイティド 力反応式検出器及びシステム、並びにそれらの製造方法
JP2001195945A (ja) * 2000-01-06 2001-07-19 Polymatech Co Ltd 感圧導電センサー
JP2006513408A (ja) * 2003-01-07 2006-04-20 アイイーイー インターナショナル エレクトロニクス アンド エンジニアリング エス．エイ． 微細構造化面をもつ弾性センサ層で構成される圧力センサ
JP2009298063A (ja) * 2008-06-16 2009-12-24 Nippon Zeon Co Ltd 積層体及び配線基板
WO2011024902A1 (ja) * 2009-08-28 2011-03-03 日本写真印刷株式会社 圧力検出ユニット及び圧力検出装置
JP2012145447A (ja) * 2011-01-12 2012-08-02 Canon Chemicals Inc 感圧導電ゴム部材及び感圧センサ
JP2012159463A (ja) * 2011-02-02 2012-08-23 Canon Chemicals Inc 感圧センサ体
US20120256720A1 (en) * 2011-04-08 2012-10-11 Samsung Electronics Co., Ltd. Bending sensor and method for fabricating the same
JP2014163815A (ja) * 2013-02-26 2014-09-08 Seiko Epson Corp 力検出装置およびロボット
JP2017009559A (ja) * 2015-06-26 2017-01-12 ヤマハ株式会社 歪みセンサ素子

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Publication number Publication date
WO2020195460A1 (ja) 2020-10-01

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