JPWO2020189309A1 - - Google Patents
Info
- Publication number
- JPWO2020189309A1 JPWO2020189309A1 JP2021507189A JP2021507189A JPWO2020189309A1 JP WO2020189309 A1 JPWO2020189309 A1 JP WO2020189309A1 JP 2021507189 A JP2021507189 A JP 2021507189A JP 2021507189 A JP2021507189 A JP 2021507189A JP WO2020189309 A1 JPWO2020189309 A1 JP WO2020189309A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019052976 | 2019-03-20 | ||
PCT/JP2020/009452 WO2020189309A1 (en) | 2019-03-20 | 2020-03-05 | Resin composition for sealing, electronic component device, and production method for electronic component device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2020189309A1 true JPWO2020189309A1 (en) | 2020-09-24 |
Family
ID=72520777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021507189A Pending JPWO2020189309A1 (en) | 2019-03-20 | 2020-03-05 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2020189309A1 (en) |
TW (1) | TW202102567A (en) |
WO (1) | WO2020189309A1 (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6076528A (en) * | 1983-10-03 | 1985-05-01 | Toyota Central Res & Dev Lab Inc | Epoxy resin composition |
JPS6076529A (en) * | 1983-10-03 | 1985-05-01 | Toyota Central Res & Dev Lab Inc | Epoxy resin composition |
JPS60124620A (en) * | 1983-12-12 | 1985-07-03 | Toyota Central Res & Dev Lab Inc | Epoxy resin composition |
JP2011132507A (en) * | 2009-11-26 | 2011-07-07 | Ajinomoto Co Inc | Epoxy resin composition |
JP2016027133A (en) * | 2014-06-30 | 2016-02-18 | 新日鉄住金化学株式会社 | Aromatic polyester-containing curable resin composition, cured product, electric/electronic component and circuit board |
JP2017048400A (en) * | 2016-11-29 | 2017-03-09 | 味の素株式会社 | Resin composition |
JP2018145409A (en) * | 2017-03-03 | 2018-09-20 | 味の素株式会社 | Resin composition |
-
2020
- 2020-03-05 WO PCT/JP2020/009452 patent/WO2020189309A1/en active Application Filing
- 2020-03-05 JP JP2021507189A patent/JPWO2020189309A1/ja active Pending
- 2020-03-17 TW TW109108795A patent/TW202102567A/en unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6076528A (en) * | 1983-10-03 | 1985-05-01 | Toyota Central Res & Dev Lab Inc | Epoxy resin composition |
JPS6076529A (en) * | 1983-10-03 | 1985-05-01 | Toyota Central Res & Dev Lab Inc | Epoxy resin composition |
JPS60124620A (en) * | 1983-12-12 | 1985-07-03 | Toyota Central Res & Dev Lab Inc | Epoxy resin composition |
JP2011132507A (en) * | 2009-11-26 | 2011-07-07 | Ajinomoto Co Inc | Epoxy resin composition |
JP2016027133A (en) * | 2014-06-30 | 2016-02-18 | 新日鉄住金化学株式会社 | Aromatic polyester-containing curable resin composition, cured product, electric/electronic component and circuit board |
JP2017048400A (en) * | 2016-11-29 | 2017-03-09 | 味の素株式会社 | Resin composition |
JP2018145409A (en) * | 2017-03-03 | 2018-09-20 | 味の素株式会社 | Resin composition |
Also Published As
Publication number | Publication date |
---|---|
WO2020189309A1 (en) | 2020-09-24 |
TW202102567A (en) | 2021-01-16 |
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