JPWO2020184003A1 - - Google Patents

Info

Publication number
JPWO2020184003A1
JPWO2020184003A1 JP2021505594A JP2021505594A JPWO2020184003A1 JP WO2020184003 A1 JPWO2020184003 A1 JP WO2020184003A1 JP 2021505594 A JP2021505594 A JP 2021505594A JP 2021505594 A JP2021505594 A JP 2021505594A JP WO2020184003 A1 JPWO2020184003 A1 JP WO2020184003A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021505594A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020184003A1 publication Critical patent/JPWO2020184003A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2021505594A 2019-03-13 2020-02-05 Pending JPWO2020184003A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019045876 2019-03-13
PCT/JP2020/004377 WO2020184003A1 (en) 2019-03-13 2020-02-05 Semiconductor device and image capture device

Publications (1)

Publication Number Publication Date
JPWO2020184003A1 true JPWO2020184003A1 (en) 2020-09-17

Family

ID=72427832

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021505594A Pending JPWO2020184003A1 (en) 2019-03-13 2020-02-05

Country Status (2)

Country Link
JP (1) JPWO2020184003A1 (en)
WO (1) WO2020184003A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3120987B1 (en) * 2021-03-22 2023-05-26 St Microelectronics Grenoble 2 CHIP PACKAGING DEVICE AND METHOD FOR MAKING THE SAME

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6126055U (en) * 1984-07-20 1986-02-17 東静容器株式会社 Quantitative dispensing container
JPS6178638U (en) * 1984-10-31 1986-05-26
JP3056212B1 (en) * 1999-04-22 2000-06-26 三菱電機株式会社 Microwave package structure
US6448637B1 (en) * 2001-11-28 2002-09-10 Intersil Americas Inc. Hermetically sealed integrated circuit package incorporating pressure relief valve for equalizing interior and exterior pressures when placed in spaceborne environment
JP2004119881A (en) * 2002-09-27 2004-04-15 Sony Corp Semiconductor device and its manufacturing method
US20040144435A1 (en) * 2003-01-23 2004-07-29 Dark Richard C.G. Check valve
JP4890305B2 (en) * 2007-03-15 2012-03-07 トヨタ自動車株式会社 Liquid filled vibration isolator
JP2008311940A (en) * 2007-06-14 2008-12-25 Yamaha Corp Semiconductor device and manufacturing method thereof
JP2010212511A (en) * 2009-03-11 2010-09-24 Kyocera Corp Electronic device and electronic system
JP2011159900A (en) * 2010-02-03 2011-08-18 Panasonic Corp Solid-state imaging apparatus

Also Published As

Publication number Publication date
WO2020184003A1 (en) 2020-09-17

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